Chip Package EMI Shielding Layer for Reliable Circuit Protection
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Solution Overview
Problem
Semiconductor chips are vulnerable to electromagnetic interference (EMI) from their environment, which can degrade their performance or cause them to malfunction, highlighting the need for effective shielding in chip packages.
Innovation Solution
A chip package structure incorporating a substrate with blind holes, circuit layers, insulating layers, and a metal electromagnetic interference shielding layer that covers the first surface of the insulating layer to prevent external EMI, ensuring electrical connectivity between the chip and circuit layers while shielding from external interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor chips are used in various applications, then their functionality and application range are improved, but they become vulnerable to electromagnetic interference which degrades performance
Solution Approach 1:
An electromagnetic interference shielding layer is introduced as an intermediary component between the external environment and the semiconductor chip. This shielding layer, positioned on the substrate, blocks electromagnetic waves from reaching the chip circuits, thereby protecting chip performance while allowing the chip to maintain its wide application range across computers, mobile phones, automobiles, and medical devices
2Reliability
If electromagnetic interference shielding is added to protect chips, then chip performance and reliability are improved, but the device structure becomes more complex
Solution Approach 1:
The electromagnetic interference shielding layer is merged with the substrate structure of the chip package. The shielding layer is integrated into the packaging architecture alongside the chip, circuit boards, and insulating layers, forming a unified structure that provides both mechanical support and electromagnetic protection without requiring separate standalone shielding components
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for the chip and circuit boards, enables electrical connections through conductive patterns, and simultaneously acts as a platform for the electromagnetic interference shielding layer. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed chip package effectively shields semiconductor chips from external electromagnetic interference, enhancing their performance and reliability by preventing EMI from affecting the circuit layers and chips.
Implementation Method 1
The electromagnetic interference shielding layer is made of metals and covering a first surface of the first insulating layer completely for preventing the respective first circuit layers, the respective second circuit layers, and the respective chips from external electromagnetic interference
Data Source
AI summary
A chip package with an electromagnetic interference shielding layer and a method of manufacturing the same are provided. The chip package includes a substrate, at least one first circuit layer, at least one second circuit layer, at least one chip, a first insulating layer, and at least one electromagnetic interference shielding layer. The electromagnetic interference shielding layer is made of metals and covering a first surface of the first insulating layer completely for preventing the respective first circuit layers, the respective second circuit layers, and the respective chips from external electromagnetic interference (EMI).