Chip Package Pressure Monitoring for Real-Time Failure Threshold Testing
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Solution Overview
Problem
Existing methods for determining the functional failure threshold of chip packages are inefficient, as they require numerous test iterations and cannot accurately distinguish between strength and functional testing failures, leading to erroneous results.
Innovation Solution
A monitoring apparatus that applies pressure to a package without moving it, using high-pressure gas for static and dynamic mechanical testing, and includes sensors to monitor the chip's standby current and strain, enabling real-time detection of chip damage and accurate determination of package strength based on functional failure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If repeated static and dynamic mechanical tests are conducted to determine functional failure threshold, then the functional failure threshold can be determined, but the testing process becomes time-consuming and inefficient
Solution Approach 1:
The patent applies preliminary action by integrating real-time functional monitoring capabilities into the testing system before actual mechanical tests are conducted. The monitoring apparatus continuously tracks chip functionality during testing, allowing immediate detection of functional failure without requiring multiple iterative tests. This preliminary integration of monitoring functions enables the system to determine the functional failure threshold in a single test sequence rather than through repeated iterations.
2Productivity
If conventional testing methods are used without real-time monitoring, then the testing process is simpler, but the accuracy of determining functional failure threshold deteriorates
Solution Approach 1:
The patent implements feedback by incorporating a monitoring apparatus that continuously observes chip functionality during mechanical testing. The system receives real-time signals from the chip and provides feedback about its functional state. When functional failure is detected through this feedback mechanism, the testing process can immediately conclude with an accurate determination of the functional failure threshold, thereby improving both testing efficiency and measurement precision simultaneously.
3Reliability
If multiple test iterations are performed to account for chip damage, then more accurate results can be obtained, but the complexity of the testing process increases
Solution Approach 1:
The patent applies merging by combining the mechanical testing function with real-time functional monitoring into a single integrated testing system. Rather than performing separate mechanical tests followed by separate functional verification tests, the system merges these functions so that mechanical loading and functional monitoring occur simultaneously. This integration maintains high testing reliability by detecting chip damage in real-time while avoiding the complexity of multiple separate test iterations and procedures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus allows for real-time monitoring of chip damage and functional failure, reducing the need for multiple test iterations and providing accurate package strength values, thereby improving the reliability of chip package testing.
Implementation Method 1
a pressure applying device configured to apply a pressure to the package
Implementation Method 2
a sensor configured to measure the pressure applied to the package by the pressure applying device
Data Source
AI summary
A monitoring apparatus for a package includes a pressure applying device configured to apply a pressure to the package, a sensor configured to measure the pressure applied to the package by the pressure applying device, and a signal transmitting apparatus electrically coupled to the package and configured to input an input signal to a chip of the package, receive an output signal from the package in real time, and monitor a damage of the chip of the package in real time while the pressure applying device applies the pressure to the package.