Heat-Dissipation Chip Package Structure with Pre-Attachment Film
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Solution Overview
Problem
Conventional semiconductor chip structures face challenges in heat dissipation and packaging, where the chip is easily damaged due to inadequate heat dissipation and the potting compound obstructs effective heat transfer, requiring costly and incomplete cleaning processes.
Innovation Solution
A high heat-dissipation chip package structure is developed by adhering a pre-attachment film on a heat-dissipation plate or connection plate, packaging, then removing the film to expose the surface, and electroplating a metal layer for improved heat dissipation and electrical conductivity, reducing the need for extensive cleaning and enhancing packaging quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the chip is packaged by potting compound, then the chip is protected, but the heat dissipation effect deteriorates due to the potting compound blocking heat transfer
Solution Approach 1:
The invention divides the package structure into distinct regions: a first exposed surface area of the heat-dissipation plate that is not covered by potting compound and a second covered surface area. This segmentation allows the heat-dissipation plate to function both as a protective element and as an active heat dissipation surface, resolving the contradiction between chip protection and heat dissipation effectiveness.
2Temperature
If the heat-dissipation plate is attached on the chip, then the heat dissipation effect is improved, but the chip is still packaged in potting compound which blocks heat transfer
Solution Approach 1:
The package structure is segmented to expose a first surface area of the heat-dissipation plate while covering a second surface area with potting compound. This allows the heat-dissipation plate to maintain direct thermal contact with the chip for effective heat dissipation while still providing protective encapsulation, thus resolving the contradiction between heat dissipation improvement and heat transfer efficiency.
3Temperature
If the potting compound is cleaned from the heat-dissipation plate, then the heat dissipation effect is improved, but the cleaning process is costly and cannot totally remove the potting compound
Solution Approach 1:
The invention performs preliminary action by designing the package structure to inherently expose a first surface area of the heat-dissipation plate during the packaging process itself, rather than requiring subsequent cleaning operations. The mold structure is configured to prevent potting compound from covering this first surface area, thus achieving effective heat dissipation without costly and incomplete cleaning processes.
4Device complexity
If the lower surface of the base is exposed to the potting compound, then the structure is simple, but only the lower surface has heat dissipation effect while the chip has worse heat dissipation
Solution Approach 1:
The invention segments the heat dissipation function between the base and the heat-dissipation plate. The base provides structural support with its lower surface exposed for heat dissipation, while the heat-dissipation plate attached to the chip provides additional heat dissipation surface area. This segmentation maintains structural simplicity while significantly improving chip heat dissipation effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the cleaning process, maintains optimal heat dissipation, and enhances electrical conductivity by ensuring the metal layer is not covered by the potting compound, thereby protecting the chip module and maintaining effective heat transfer.
Implementation Method 1
a metal layer is electroplated on the location of the upper surface of the heat-dissipation plate or the connection plate where the pre-attachment film is torn off
Data Source
AI summary
A high heat-dissipation chip package structure for packaging the semiconductor chips is disclosed. A pre-attachment film is adhered on an upper surface of a heat-dissipation plate or a connection plate first and then it is packaged. After packaging, the pre-attachment film is torn off from the upper surface of the heat-dissipation plate or the connection plate. Finally, a metal layer is electroplated on the location of the upper surface of the heat-dissipation plate or the connection plate where the pre-attachment film is torn off so as to improve the fabricating and packaging quality of the semiconductor chips, reduce the cost of cleaning process, and improve the effects of heat dissipation and electrical conductivity.