Chip Package Heat Dissipation Plate With Fixed Connectors Against Delamination
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Solution Overview
Problem
The existing chip packaging structures face delamination issues due to differences in warpage caused by varying thermal expansion coefficients between chips and heat dissipation plates, leading to reliability failures.
Innovation Solution
The introduction of fixed connectors with higher connection strength than the thermal interface material, distributed between the heat dissipation plate and the chip, to enhance the bonding force and reduce warpage, along with a manufacturing method involving bonded metal blocks and specific connector distributions for improved structural and thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal interface material is used to connect the chip and heat dissipation plate, then heat conduction is achieved, but delamination occurs due to warpage difference caused by different thermal expansion coefficients
Solution Approach 1:
The connection structure is segmented into multiple components: the heat dissipation plate, the chip, and multiple fixed connectors distributed at different positions (corners and edges). This segmentation allows each component to handle stress independently, preventing delamination while maintaining thermal contact through the thermal interface material.
Solution Approach 2:
Fixed connectors are strategically placed at specific locations (four corners and four sides of the non-functional surface) where warpage stress is most critical. This local reinforcement provides targeted support to areas experiencing the greatest thermal expansion differential, preventing delamination without requiring uniform reinforcement across the entire connection interface.
2Strength
If fixed connectors are added to increase connection strength, then delamination is prevented, but device complexity increases
Solution Approach 1:
The fixed connectors serve multiple functions simultaneously: they provide mechanical support to prevent delamination, anchor the thermal interface material in position, and maintain thermal contact between the chip and heat dissipation plate. This multi-functionality reduces the need for separate components for each function, thereby limiting the increase in device complexity.
3Ease of manufacture
If uniform distribution of fixed connectors is used, then manufacturing is simplified, but connection strength at critical stress points is insufficient
Solution Approach 1:
The fixed connectors are non-uniformly distributed with higher concentration at the four corners and four sides of the non-functional surface, where thermal expansion stress is most intense. This localized reinforcement strategy provides maximum connection strength at critical stress points while maintaining reasonable manufacturing complexity by following a predictable placement pattern.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution increases the connection strength between the chip and heat dissipation plate, reduces the risk of delamination, and enhances heat conduction efficiency by using high thermal conductivity adhesives, thereby improving the reliability and thermal performance of the packaging structure.
Implementation Method 1
The chip and the heat dissipation plate are connected by a thermal interface material, and the thermal conductivity of the thermal interface material is determined by its own material characteristics and coverage rate
Implementation Method 2
the heat dissipation plate and the chip are connected by at least one fixed connector, a connection strength between the fixed connector and the chip or the heat dissipation plate is greater than a connection strength between the thermal interface material and the chip or the heat dissipation plate
Data Source
AI summary
The present invention provides a chip packaging structure having a heat dissipation plate and a manufacturing method thereof. The packaging structure includes a substrate; at least one chip, disposed on a first surface of the substrate; the heat dissipation plate is bonded to the first surface, the heat dissipation plate and the substrate form a cavity in a surrounding manner for holding the chip therein, the heat dissipation plate and the chip are connected by at least one fixed connector, a thermal interface material is filled in a region among the heat dissipation plate, the chip and the fixed connector, and a connection strength between the fixed connector and the chip or the heat dissipation plate is greater than a connection strength between the thermal interface material and the chip or the heat dissipation plate. Thus, the connection strength between the chip and the heat dissipation plate is increased.