Device Chip Package Groove Inclination Compensation
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Solution Overview
Problem
In semiconductor device manufacturing, the use of cutting blades with very small edge thickness leads to bent cutting edges and inclined cut grooves, resulting in incomplete resin sealing of side surfaces during the laser processing of device chips.
Innovation Solution
A method involving a cutting step to form cut grooves, a detection step for groove inclination, a resin sealing step, a grinding step for thickness adjustment, and a laser processing step where the laser beam is applied parallel to the cut grooves with an inclined chuck table to ensure complete resin sealing of both top and side surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a cutting blade with very small edge thickness is used to narrow the streets, then the number of device chips obtained is increased, but the cutting edge becomes bent and the cut grooves become inclined
Solution Approach 1:
The patent performs preliminary detection of cut groove inclination using a laser displacement gage before the laser cutting process. By detecting the inclination state in advance and storing it in memory, the system can compensate for the inclined grooves during subsequent processing, ensuring complete resin sealing even when using thin cutting blades to increase chip yield
2Speed
If the cut grooves are irradiated with a laser beam without inclination detection, then the processing speed is maintained, but the side surfaces of the half cut grooves are irradiated and the device chip side surfaces are not completely sealed with resin
Solution Approach 1:
The patent implements a feedback mechanism where the laser displacement gage continuously detects the inclination state of cut grooves, and this information is used to adjust the laser beam application. The system reads the stored inclination data and applies the laser beam at the appropriate angle to ensure the beam travels along the groove without irradiating the side surfaces, maintaining both speed and sealing quality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method prevents incomplete resin sealing on the side surfaces of device chip packages by detecting and compensating for groove inclination, ensuring all surfaces are sealed with resin during the laser processing.
Implementation Method 1
applying a laser beam having a wavelength absorbable by the sealing resin layer along the cut grooves of the device wafer held by the chuck table
Data Source
AI summary
Disclosed herein is a device chip package manufacturing method including a cutting step of forming cut grooves having a depth reaching a finished thickness of device chips by cutting a device wafer from a top surface of the device wafer along streets by a cutting blade, a cut groove inclination state detecting step of detecting an inclination state of the cut grooves, a sealing resin layer forming step of forming a sealing resin layer coating the top surface and the cut grooves of the device wafer by supplying a sealing resin to the top surface of the device wafer, and a laser processing step of dividing the device wafer into individual chips and forming device chip packages by applying a laser beam having a wavelength absorbable by the sealing resin layer along the cut grooves of the device wafer held by a chuck table.