Ceramic Chip Package Bonding With Grooved Copper Surfaces
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Solution Overview
Problem
Conventional chip package structures face high manufacturing costs due to the extensive use of noble metals, and they suffer from insufficient heterogeneous bonding strength between copper surfaces and encapsulation gels, leading to reliability issues under high-temperature or high-pressure environments.
Innovation Solution
A chip package structure with a ceramic substrate, copper structure, and encapsulation gel, featuring a surface treatment layer on the copper surface not in contact with the ceramic substrate or noble metal layer, and grooves or copper pillars to enhance bonding strength, reducing the need for noble metals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If noble metal materials are extensively used to improve reliability and electrical performance, then the electrical performance and reliability are improved, but the manufacturing cost increases significantly
Solution Approach 1:
The patent applies local quality by selectively placing noble metal layers only in specific regions where electrical performance is critical, rather than extensively throughout the entire chip package structure. This localized application maintains the necessary electrical performance while significantly reducing the total amount of noble metal material required, thereby lowering manufacturing costs.
Solution Approach 2:
The patent extracts or removes unnecessary noble metal layers from non-critical areas of the chip package structure. By identifying and eliminating redundant noble metal applications, the design maintains reliability in essential regions while reducing overall material usage and manufacturing cost.
2Reliability
If noble metal layers are extensively used to improve electrical performance, then the electrical performance is improved, but the material waste increases
Solution Approach 1:
The patent implements local quality by concentrating noble metal materials only in regions where they provide essential electrical performance benefits. This targeted approach eliminates waste in non-critical areas while preserving electrical performance where needed, thus reducing material waste without compromising functionality.
Solution Approach 2:
The patent applies partial action by using noble metal layers only to the extent necessary for achieving required electrical performance, rather than applying them excessively throughout the entire structure. This partial application strategy optimizes material utilization and reduces waste.
3Reliability
If physical roughening or chemical treatment is applied to enhance heterogeneous bonding strength, then the bonding strength is improved, but the process complexity and material cost increase
Solution Approach 1:
The patent applies preliminary action by pre-forming groove structures on the copper surface before encapsulation. These pre-designed grooves create mechanical interlocking features that enhance bonding strength without requiring subsequent complex physical roughening or chemical treatment processes, thereby simplifying the overall manufacturing process.
Solution Approach 2:
The patent uses segmentation by dividing the copper surface into regions with grooves and regions without grooves. The grooved regions provide enhanced bonding strength where needed, while flat regions maintain simplicity. This segmented approach achieves improved bonding without uniformly complicating the entire surface treatment process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances bonding strength between the encapsulation gel and copper structure, reducing noble metal usage and manufacturing costs while maintaining reliability and design flexibility.
Implementation Method 1
the encapsulation gel is bonded to the copper structure by contacting the surface treatment layer
Implementation Method 2
the encapsulation gel fills and is engaged with the groove
Data Source
AI summary
A chip package structure includes a ceramic substrate, a copper structure, a noble metal layer, a chip, and an encapsulation gel. The copper structure is formed on the ceramic substrate, and at least one sidewall of the copper structure is recessed to form a groove. The noble metal layer is formed on the copper structure. The chip is disposed on the noble metal layer. The encapsulation gel is formed on the ceramic substrate to encapsulate the copper structure, the noble metal layer, and the chip. A surface treatment layer is formed on an exposed copper surface of the copper structure that is not in contact with the ceramic substrate and the noble metal layer, and the encapsulation gel contacts the surface treatment layer for bonding to the copper structure. The surface treatment layer extends to a surface inside the groove, and the encapsulation gel further fills the groove.