Chip Package Grounding Region Reduces Conductive Bumps
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Solution Overview
Problem
The increasing demand for miniaturized semiconductor chips with complex functionality complicates the packaging process due to the need for additional input/output conductive pads, reducing manufacturing yields.
Innovation Solution
A chip package structure comprising a carrier substrate with a grounding region, semiconductor chips, a fill material layer, and conductive bumps, where the semiconductor chips are electrically connected to the grounding region, reducing the number of required conductive bumps and facilitating the packaging process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple semiconductor chips are placed in a sealed package to meet performance demands, then operational stability is improved, but the number of input/output conductive pads increases making the packaging process more difficult and reducing manufacturing yields
Solution Approach 1:
The patent merges multiple grounding functions into a single shared grounding structure formed in the carrier substrate. Instead of providing separate grounding connections for each semiconductor chip, the invention creates a common grounding region that serves multiple chips simultaneously, thereby reducing the total number of conductive pads required and simplifying the packaging process while maintaining operational stability
Solution Approach 2:
The grounding structure in the carrier substrate serves multiple functions: it provides electrical grounding for multiple semiconductor chips, acts as a heat dissipation path, and serves as a structural support element. This multi-functionality reduces the number of separate components needed and simplifies the overall packaging process
2Adaptability or versatility
If more input/output conductive pads are required for multiple semiconductor chips, then functionality is improved, but the packaging process becomes more difficult
Solution Approach 1:
The patent transitions from a planar arrangement of separate conductive pads for each chip to a three-dimensional grounding structure formed within the carrier substrate. The grounding region extends vertically through the substrate, allowing multiple chips at different levels to access the same grounding path, thereby reducing the number of surface pads required while maintaining full functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the semiconductor packaging process by reducing the number of conductive bumps needed and provides heat dissipation for the chips, addressing the challenges of miniaturization and increased functionality.
Implementation Method 1
provides heat dissipation for the chips
Data Source
AI summary
A chip package is disclosed. The package includes a carrier substrate, at least two semiconductor chips, a fill material layer, a protective layer, and a plurality of conductive bumps. The carrier substrate includes a grounding region. The semiconductor chips are disposed overlying the grounding region of the carrier substrate. Each semiconductor chip includes at least one signal pad and includes at least one grounding pad electrically connected to the grounding region. The fill material layer is formed overlying the carrier substrate and covers the semiconductor chips. The protective layer covers the fill material layer. The plurality of conductive bumps is disposed overlying the protective layer and is electrically connected to the semiconductor chips. A fabrication method of the chip package is also disclosed.