Semiconductor Chip Package Heat Dissipating Structure
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Solution Overview
Problem
Existing semiconductor chip packages face challenges in effectively dissipating heat generated by large-scale integrated chips, as conventional methods such as heat slugs and wire connections hinder efficient heat transfer, and lack adequate protection against mechanical stress, leading to potential chip damage and operational errors.
Innovation Solution
A semiconductor chip package design featuring exposed lower surfaces of lead frames and a partially cut-out package body to allow bottom surface exposure of the chip, with optional filling materials like silica, alumina, or metallic powders for enhanced heat dissipation, and the use of heat sink plates for improved thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat slugs are used for heat dissipation, then heat dissipation is improved, but heat dissipation is insufficient for large-scale integrated semiconductor chip packages
Solution Approach 1:
The patent transitions from single-point heat slug dissipation to multi-dimensional heat dissipation by exposing both the upper surface (via cutout) and lower surfaces (via lead frame exposure) of the semiconductor chip, creating three-dimensional heat dissipation pathways that significantly improve thermal management for large-scale integrated chips
Solution Approach 2:
The heat dissipation function is segmented into multiple independent pathways: upper surface exposure through cutout, lower surface exposure through lead frame, and side surface exposure, allowing heat to dissipate through multiple separate channels simultaneously rather than relying on a single heat slug
2Reliability
If bonding wires are used to connect semiconductor chip to pattern leads, then electrical connection is achieved, but heat transfer is hindered
Solution Approach 1:
The patent extracts the heat transfer function from the electrical connection system by exposing the semiconductor chip surfaces directly to the environment, separating thermal management from electrical connectivity and allowing heat to dissipate independently without relying on the bonding wire pathway
Solution Approach 2:
The patent introduces the package body cutout and exposed lead frames as intermediary structures that facilitate direct heat transfer from the semiconductor chip to the environment, bypassing the inadequate thermal conduction through bonding wires and pattern leads
3Reliability
If semiconductor chip is mounted on substrate and enclosed in package body, then protection is provided, but heat dissipation is restricted
Solution Approach 1:
The package body is designed with localized cutouts and selective exposure regions that maintain protective enclosure in most areas while creating specific zones for heat dissipation, allowing the structure to simultaneously provide protection and thermal management functionality
Solution Approach 2:
The patent adds vertical dimension heat dissipation pathways by exposing the lower surfaces of the semiconductor chip through lead frame exposure, complementing the traditional upper surface dissipation and creating multi-directional thermal management within the protected package structure
4Strength
If package body is fully enclosed, then protection against mechanical stress is improved, but heat dissipation efficiency deteriorates
Solution Approach 1:
The package body employs a flexible enclosure design with strategic openings that maintain structural protection while allowing thermal energy to pass through, creating a balance between mechanical integrity and thermal transparency in the package structure
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances heat dissipation efficiency, protects the chip and lead frames, and improves durability by allowing effective heat transfer through both upper and lower surfaces, while also providing structural protection against mechanical stress.
Implementation Method 1
the heat, generated in a semiconductor chip, to be easily dissipated from a package to the outside
Implementation Method 2
optional filling materials like silica, alumina, or metallic powders for enhanced heat dissipation
Data Source
AI summary
Disclosed herein is a semiconductor chip package having a heat dissipating structure. The semiconductor chip package including: a semiconductor chip configured such that a plurality of terminals protrudes from the upper surface thereof; lead frames connected to the terminals located on the upper surface of the semiconductor chip; and a package body configured to protect the semiconductor chip and the lead frames and to form the outside shape of the semiconductor chip package, and formed by molding. The lower surfaces of the lead frames are exposed to the outside. The lower surface of the package body is partially cut out such that the bottom surface of the semiconductor chip is exposed to the outside.