Chip Package Heat Dissipation Element Exposure
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Solution Overview
Problem
Conventional semiconductor packages with encapsulants of poor thermal conductivity and complex heat dissipation designs face limitations in efficiently dissipating heat from semiconductor chips, leading to reduced production quality and efficiency.
Innovation Solution
A chip package device with a heat dissipation element exposed externally, where the heat dissipation element is attached to an adhesive layer covering the chip and partially enclosed by an encapsulation with an indented opening, allowing for effective heat dissipation without the need for cutting the heat sink module plate, thus simplifying the manufacturing process and improving yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the encapsulant completely encloses the heat sink module plate to protect it, then the structural integrity is improved, but the heat dissipation efficiency deteriorates because the heat sink cannot be exposed externally
Solution Approach 1:
The encapsulation is segmented into two parts: a first encapsulation that completely encloses the interface layer/heat sink module plate combination, and a second encapsulation that encloses the semiconductor chip and wires but leaves the heat sink module plate exposed. This segmentation allows the heat sink to be exposed for heat dissipation while maintaining structural protection through the first encapsulation.
2Strength
If the interface layer is tightly adhered to the heat sink module plate during encapsulation to ensure bonding strength, then the bonding strength is improved, but the ease of removing the interface layer and encapsulant deteriorates
Solution Approach 1:
A release layer is applied to the heat sink module plate before the interface layer is adhered to it. This preliminary action of applying the release layer ensures that while the interface layer bonds strongly to the heat sink during encapsulation, it can be easily removed later by peeling off the release layer, thus resolving the contradiction between bonding strength and ease of removal.
3Productivity
If cutting tools are used to cut the encapsulated body containing the metal heat sink module plate, then the encapsulated body can be divided into separate parts, but the manufacturing precision deteriorates due to tool wear and inability to cut metal neatly
Solution Approach 1:
The encapsulation is divided into two separate encapsulations: a first encapsulation that completely encloses the interface layer/heat sink module plate combination and can be easily cut and removed, and a second encapsulation that encloses the semiconductor chip and wires. This segmentation eliminates the need to cut through the metal heat sink module plate, thereby avoiding tool wear and poor cutting quality while still allowing the encapsulated body to be divided into separate parts.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced heat dissipation efficiency and simplifies the manufacturing process by exposing the heat dissipation element externally, reducing tool wear and improving production quality.
Implementation Method 1
the heat dissipation element is attached to an adhesive layer covering the chip
Data Source
AI summary
A chip package device includes a substrate having a chip bonding area and at least one contact pad, a chip having an active surface and an inactive surface, at least one wire, an adhesive layer, a heat dissipation element, and an encapsulation. The chip is disposed on the chip bonding area with its inactive surface facing the substrate. The chip includes at least one bonding pad disposed on the active surface. The wire correspondingly connects the at least one bonding pad and the at least one contact pad. The adhesive layer covers the active surface of the chip and encloses a portion of the wire extending over the bonding pad. The heat dissipation element is attached to the adhesive layer and covers the chip. The encapsulation partially encloses the periphery of the assembly including the chip, the adhesive and the heat dissipation element, and has an indented opening to expose the surface of the heat dissipation element.