Integrated Heat Dissipation Pillars in Chip Package Structures
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Solution Overview
Problem
The existing chip package structures face challenges in heat dissipation efficiency and reliability due to the detachment of heat sinks, leading to increased production costs and reduced yield.
Innovation Solution
A chip package structure incorporating a leadframe with a die pad and heat dissipation pillars, where the heat dissipation pillars are directly plated on the chip's back surface and pass through the die pad's through hole, encapsulated by a molding compound that exposes them, enhancing heat dissipation without the need for additional heat sinks or pastes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat sink is adhered to the package structure using adhesive or solder, then heat dissipation is improved, but the heat sink may detach or fall off, reducing reliability and increasing costs
Solution Approach 1:
The patent merges the heat dissipation function directly into the package structure by forming heat dissipation pillars from the substrate itself. The substrate is designed with through-holes that are filled with conductive material to create integrated heat dissipation pillars, eliminating the need for separate heat sink components and their associated fixation issues.
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support, electrical connection, and heat dissipation. The heat dissipation pillars are formed as an integral part of the substrate structure, allowing the substrate to simultaneously perform structural and thermal management functions without requiring additional components.
2Temperature
If additional heat dissipation components are added to the package structure, then heat dissipation efficiency is improved, but device complexity and production costs increase
Solution Approach 1:
The heat dissipation function is merged into the existing substrate structure through the formation of heat dissipation pillars. This integration eliminates the need for separate heat sink components, reducing device complexity while maintaining effective heat dissipation.
Solution Approach 2:
The substrate is designed to perform multiple functions including mechanical support, electrical connection, and heat dissipation. The heat dissipation pillars are formed as an integral part of the substrate, allowing it to simultaneously serve structural and thermal management roles without adding complexity.
3Temperature
If additional heat dissipation components and materials are used, then heat dissipation performance is improved, but production costs increase
Solution Approach 1:
The heat dissipation function is merged into the substrate structure itself, eliminating the need for separate heat sink components and adhesive materials. This integration reduces the bill of materials and simplifies the manufacturing process, thereby reducing production costs.
Solution Approach 2:
The substrate serves multiple functions including mechanical support, electrical connection, and heat dissipation. By forming heat dissipation pillars as an integral part of the substrate, the design eliminates the need for additional components and materials, reducing production costs while maintaining heat dissipation performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation performance while reducing production costs by eliminating the need for extra heat dissipation components and maintaining electrical performance despite exposure of the heat dissipation pillars.
Implementation Method 1
The heat dissipation pillar is located on the back surface and passes through the through hole
Data Source
AI summary
A chip package structure including a leadframe, a chip, at least one heat dissipation pillar, and a molding compound is provided. The leadframe includes a die pad and a plurality of leads. The die pad has at least one through hole. The leads surround the die pad. The chip is located on the die pad and electronically connected to the leads. The chip includes an active surface and a back surface opposite to the active surface. The back surface of the chip is adhered to the die pad. The heat dissipation pillar is located on the back surface and passes through the through hole. The molding compound encapsulates the chip, at least parts of the leads, and the die pad. The molding compound includes at least one opening to expose the heat dissipation pillar. A manufacturing method of the chip package structure is also provided.