Chip Package Structure With Integrated Heat Sink and Flexible Electrode Layout
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing chip packaging technologies limit the flexibility of chip installation to specific circuit boards due to fixed electrode positions, requiring soldering or gluing for heat sinks, which can lead to manufacturing defects and inefficient heat dissipation.
Innovation Solution
A chip package structure with an insulation layer and heat sink integrated through electroplating, allowing adjustable electrode positioning and direct heat dissipation via a metal layer, eliminating the need for soldering or gluing, and incorporating a thermally conductive insulation material for enhanced heat management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If solder ball soldering is used to connect chip electrodes to circuit board, then electrical connection is achieved, but the chip can only be connected to circuit boards with corresponding solder pad positions, limiting versatility
Solution Approach 1:
The patent applies the dynamics principle by making the electrode cable length adjustable rather than fixed. The electrode cable can be extended or shortened to different lengths according to the specific circuit board type and solder pad position requirements, transforming a static fixed-position system into a dynamic adaptable system that can accommodate various circuit board configurations
Solution Approach 2:
The patent applies parameter changes by modifying the cable length parameter of the electrode cable. By changing the length parameter of the cable connecting the chip electrode to the solder ball, the system can adapt to different solder pad positions on various circuit boards, thereby improving compatibility without changing the fundamental soldering connection method
2Temperature
If heat sink is fixed to packaging layer through soldering or gluing, then heat dissipation is achieved, but manufacturing defects such as holes may occur and process complexity increases
Solution Approach 1:
The patent applies the merging principle by integrating the heat sink directly with the packaging substrate into a unified structure. The heat sink is formed as an integral part of the packaging substrate through electroplating, eliminating the need for separate fixation processes such as soldering or gluing. This combined structure prevents manufacturing defects like holes at connection interfaces and simplifies the manufacturing process while maintaining effective heat dissipation
Solution Approach 2:
The patent applies mechanics substitution by replacing mechanical fixation methods (soldering, gluing, fasteners) with an electroplating process. Instead of using mechanical or thermal joining methods that can create defects, the heat sink is directly plated onto the packaging substrate, creating a defect-free integrated structure through an electrochemical deposition process
3Ease of operation
If electrode cable position is fixed in packaging substrate, then manufacturing is simplified, but flexibility in connecting to different circuit board types is reduced
Solution Approach 1:
The patent applies dynamics by making the electrode cable length variable rather than fixed during manufacturing. The cable can be cut or extended to different lengths based on the specific application requirements and circuit board type, providing operational flexibility while maintaining a relatively simple manufacturing process through post-manufacturing cable length adjustment
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables flexible installation on various circuit boards with improved heat dissipation and reduced manufacturing defects, enhancing the stability and efficiency of heat transfer while reducing production costs.
Implementation Method 1
heat generated on the first side of the chip can be transmitted to the heat sink sequentially through the first electrode, the electrode cable, and the metal layer, and then be dissipated by using the heat sink
Implementation Method 2
the heat sink and the packaging layer in the chip package structure in this invention are integrated. Compared with a common manner of fixing the heat sink to the packaging layer through soldering, gluing, or using a fastener
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
This application provides a chip package structure and an electronic device. The chip package structure in this application includes an insulation layer, a packaging layer, and a heat sink. The heat sink is integrated with the packaging layer. Compared with a common manner of fixing the heat sink to the packaging layer through soldering, gluing, or using a fastener, a defect such as a hole does not easily occur at a position at which the heat sink and the packaging layer are combined, so that heat of the packaging layer can be efficiently transmitted to the heat sink, and a manufacturing process can be reduced. In addition, an electrode of a chip in the chip package structure of this application is led out by using an electrode cable, and an opening is disposed on the insulation layer that covers the electrode cable, to implement an electrical connection between the chip package structure and another structure of the electronic device by using the electrode cable that exposes the opening. In this way, an extension position of the electrode cable and a position of the opening on the insulation layer can be adjusted based on a type of a circuit board on which the chip package structure is installed, so that the chip package structure can be flexibly applied to various types of circuit boards.