Processor Chip Package Heat Spreader for PoP Thermal Management
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Solution Overview
Problem
In Package-on-Package (PoP) configurations, the heat dissipation from processor chip packages is inefficient due to the lack of thermal conductivity in the printed circuit board and limited thermal conduction pathways, leading to undesirable heating of memory chip packages.
Innovation Solution
A processor chip package heat spreader is positioned between the processor and memory chip packages, extending outwardly or wrapping around to create direct thermal conduction paths, using materials like graphite or heat pipes, and adhered to both chip packages to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat dissipation pathways are limited to PCB conduction and upward flow through memory chip, then the structure remains simple, but heat dissipation efficiency deteriorates due to low thermal conductivity of PCB and limited BGA connections
Solution Approach 1:
The thermal management system is segmented into multiple independent heat spreaders: a first heat spreader for the processor chip package and a second heat spreader for the memory chip package. This segmentation allows each heat spreader to independently manage heat from its respective chip, improving overall heat dissipation efficiency without requiring complex integrated thermal pathways.
Solution Approach 2:
Heat spreaders are introduced as intermediary thermal management components between the chip packages and the environment. These heat spreaders act as mediators that facilitate efficient heat transfer from the chip packages, particularly addressing the insufficient thermal conduction through the PCB by providing dedicated thermal pathways for each chip type.
2Temperature
If processor chip generates heat that flows upward through memory chip package, then thermal pathways are utilized, but memory chip package overheating occurs due to limited BGA connections and stagnant air heating
Solution Approach 1:
The thermal management system is segmented into multiple independent heat spreaders: a first heat spreader for the processor chip package and a second heat spreader for the memory chip package. This segmentation allows each heat spreader to independently manage heat from its respective chip, improving overall heat dissipation efficiency without requiring complex integrated thermal pathways.
Solution Approach 2:
Heat spreaders are introduced as intermediary thermal management components between the chip packages and the environment. These heat spreaders act as mediators that facilitate efficient heat transfer from the chip packages, particularly addressing the insufficient thermal conduction through the PCB by providing dedicated thermal pathways for each chip type.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively prevents the memory chip package from overheating by providing a direct thermal conduction path for heat dissipation from the processor chip package, improving overall heat management in PoP stack-ups.
Implementation Method 1
A processor chip package heat spreader having a bottom surface adhered to the processor chip package top surface provides a thermal conductance path for heat dissipation
Implementation Method 2
A heat spreader 115, such as a graphite sheet, is in contact with the copper conductor 111 such that heat from the memory chip package 109 is dissipated
Implementation Method 3
using materials like graphite or heat pipes
Data Source
AI summary
A chip package stack up includes a processor chip package that has a top surface and a bottom surface, an interposer, disposed above and connected to the processor chip package top surface; a memory chip package disposed above the interposer and connected to the processor chip package through the interposer; and a processor chip package heat spreader having a bottom surface adhered to the processor chip package top surface, and having an extending portion that extends outwardly from an edge of the processor chip package.