Chip Package Thermal Interface Sealing Without Grinding

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Solution Overview

Problem

Current methods for forming chip packages, such as Dual Side Cooling, incur increased manufacturing costs and suboptimal packaging results due to the need for specialized equipment and risk of mechanical damage, especially when using film assist molding or grinding processes.

Innovation Solution

A method involving an elastic thermal interface material that is compressed by a mold to prevent packaging material from seeping and is exposed at the surface, eliminating the need for film assist molding and grinding, while enhancing thermal performance and mechanical protection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If film assist molding is used to expose the clip surface, then the thermal interface material can be exposed for cooling, but packaging material creeps between the film and surface causing mold flashes that reduce heat dissipation and require additional removal costs

Engineering Contradiction:

Improveheat dissipationVSAvoidpackaging result quality

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The mold cavity is designed with an integrated release mechanism that creates a predetermined separation plane between the packaging material and the clip surface. This preliminary structural arrangement prevents packaging material from adhering to the clip surface in the first place, eliminating mold flashes without requiring post-processing removal operations

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent extracts the problematic interaction between packaging material and clip surface by designing the mold to release the packaging material before contact with the thermal interface material occurs. This separates the packaging formation process from the thermal interface exposure process, preventing contamination

Inventive Principle:

Principle #2Taking out (Extraction)

2Temperature

If grinding is used to expose the clip or chip surface, then the surface can be exposed for cooling, but the process is expensive due to grind wheel wear and tear

Engineering Contradiction:

Improveheat dissipationVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

The mold cavity is designed with a release mechanism that pre-establishes a separation plane, allowing the thermal interface material to be exposed without requiring any post-molding grinding or mechanical removal operations. This preliminary structural design eliminates expensive abrasion-based finishing processes

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces the mechanical grinding system (grind wheels, abrasion mechanisms) with a mold-based geometric release system. Instead of using mechanical force to remove material, the mold cavity shape itself defines the exposed surface through controlled material flow and release

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Temperature

If mechanical stress is applied during package grinding, then the surface can be exposed, but additional risk to the chip or package structure is introduced

Engineering Contradiction:

Improveheat dissipationVSAvoidchip structural integrity

Core Design Contradiction:

TemperatureVSReliability

Solution Approach 1:

The mold cavity design with integrated release mechanism pre-establishes the exposed surface geometry before the chip undergoes any mechanical stress. The thermal interface material is exposed through controlled material flow and release, not through stress-induced material removal, thereby protecting chip integrity

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent applies preliminary anti-action by designing the mold to prevent packaging material from adhering to surfaces that should remain exposed. This counteracts the potential harmful effect of material adhesion before it can occur, eliminating the need for subsequent stress-based removal that would risk chip damage

Inventive Principle:

Principle #9Preliminary anti-action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces manufacturing costs, improves thermal performance by ensuring optimal heat dissipation, and protects the chip from mechanical damage during packaging without the need for additional equipment or processes.

Implementation Method 1

the elastic thermal interface material may be configured to transfer heat from the chip to an outside

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

arranging a mold around the thermal interface material and at least partially around the semiconductor chip, thereby compressing the elastic thermal interface material with the mold

Methodology Applied

Scientific EffectCompression: Compression

Data Source

PatentUS20250022768A1Method of forming a chip package and method of forming a semiconductor arrangement

Publication Date: 2025.01.16 INFINEON TECHNOLOGIES AG

AI summary

A method of forming a chip package is provided. The method may include: arranging an elastic thermal interface material over a semiconductor chip, the elastic thermal interface material being configured to transfer heat from the chip to an outside; arranging a mold around the elastic thermal interface material and at least partially around the semiconductor chip, thereby compressing the elastic thermal interface material with the mold; and filling the mold with a packaging material.