Semiconductor Chip Package Leadframe Direct Attachment
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Solution Overview
Problem
Existing semiconductor chip packages face challenges in improving connections between components, particularly in carrying high currents, where traditional wirebonding methods can be damaging and costly, and may not provide stable connections for power semiconductor products.
Innovation Solution
A semiconductor chip package design featuring a substrate with insulator and metallic layers, where a leadframe with first and second leads is directly attached to the semiconductor chip and substrate, respectively, using soldering, sintering, or glue-die attach methods, enhancing the stability and efficiency of current transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional wirebonding methods are used to connect components, then connections between components can be established, but the semiconductor chip may be damaged and costs increase
Solution Approach 1:
The patent extracts the wirebonding process entirely and replaces it with direct leadframe attachment to the semiconductor chip. The leadframe leads are directly soldered or sintered to the chip's contact pads, eliminating the intermediate wire bonds that cause damage and reliability issues. This extraction of the harmful wirebonding step while maintaining the electrical connection function resolves the contradiction between connection stability and chip damage prevention.
Solution Approach 2:
The patent introduces the leadframe as an intermediary structure that directly connects to the semiconductor chip without requiring wire bonds. The leadframe serves as both the mechanical support and the electrical connection medium, replacing the traditional wirebonding intermediary (the wire itself) with a more robust structure that can be directly attached to the chip, thereby preventing chip damage while ensuring reliable connections.
2Reliability
If traditional wirebonding methods are used, then connections can be made, but costs increase
Solution Approach 1:
The patent removes the wirebonding process step entirely from the manufacturing sequence. By directly attaching the leadframe to the semiconductor chip through soldering or sintering, it eliminates the need for specialized wire bonding equipment, materials, and process steps, thereby reducing manufacturing costs while maintaining or improving connection reliability.
Solution Approach 2:
The patent employs standard leadframe materials and conventional soldering/sintering processes that are more cost-effective than wirebonding. The leadframe structure, being a robust and reusable component, replaces expensive wire bonds and the associated bonding process, achieving both cost reduction and improved connection stability through simpler, more economical manufacturing methods.
3Use of energy by moving object
If direct leadframe attachment is used, then current transmission efficiency improves, but connection stability may be compromised
Solution Approach 1:
The patent replaces the mechanical wirebonding system with a direct metallurgical bonding system through soldering or sintering. This substitution creates a more robust electrical and mechanical connection that simultaneously improves current transmission efficiency by reducing contact resistance and enhances connection stability through the strong metallurgical bond between the leadframe and chip contact pads.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design improves the stability and efficiency of current transmission, enabling the handling of high currents without damaging the semiconductor chip and reducing costs, while providing a reliable connection for power semiconductor products.
Implementation Method 1
attaching a first lead of a leadframe to the second surface of the semiconductor chip; and attaching second lead of the leadframe to the substrate
Implementation Method 2
attaching a first lead of a leadframe to the second surface of the semiconductor chip; and attaching second lead of the leadframe to the substrate
Data Source
AI summary
A semiconductor chip package is provided with improved connections between different components within the package. The semiconductor chip package may comprise a semiconductor chip disposed on a substrate. The semiconductor chip may have a first surface and a second surface. The first surface of the semiconductor chip may be connected to the substrate. The semiconductor chip package may comprise a leadframe that includes a first lead and a second lead. The first lead of the leadframe may be directly attached to the second surface of the semiconductor chip. The second lead of the leadframe may be directly attached to the substrate.