Chip Package Lid Bonding Structure for Void-Free Heat Dissipation
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Solution Overview
Problem
The increasing integration density of semiconductor components leads to higher heat generation in chip package structures, necessitating improved heat dissipation efficiency to prevent thermal management issues.
Innovation Solution
A chip package structure is formed with a redistribution substrate, conductive pillars, an underfill layer, and a molding layer, where heat conductive structures and a ring dam are used to enhance heat dissipation by bonding a heat dissipation lid, with the ring dam constraining the heat conductive structures and allowing them to extend and contact each other during bonding, preventing void formation and improving thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If integration density of semiconductor components is increased, then more components can be integrated into a given area, but heat generation increases
Solution Approach 1:
The heat dissipation lid is divided into multiple segments or sections that can be independently bonded to the chip package. This segmentation allows for distributed heat dissipation across different areas, improving overall heat dissipation efficiency while maintaining high integration density of the semiconductor components.
Solution Approach 2:
A thermal interface material or bonding layer is introduced as an intermediary between the chip package and the heat dissipation lid. This intermediary enhances thermal coupling and heat transfer from the high-density components to the heat dissipation lid, effectively managing the heat generated by increased integration density.
2Temperature
If heat dissipation efficiency is improved through bonding heat dissipation lid, then thermal management is enhanced, but device complexity increases
Solution Approach 1:
The heat dissipation lid is merged with the existing package structure through direct bonding, integrating the thermal management function into the package itself rather than adding a separate complex cooling system. This merging approach enhances heat dissipation while minimizing increases in device complexity.
Solution Approach 2:
The heat dissipation lid serves multiple functions: it acts as a thermal management component, a structural protective cover, and potentially an electrical ground plane. This multi-functionality allows improved heat dissipation without proportionally increasing device complexity, as the same structure performs multiple roles.
3Temperature
If heat conductive structures are allowed to extend and contact each other during bonding, then thermal conductivity is improved, but void formation may occur
Solution Approach 1:
The heat conductive structures are pre-positioned and partially bonded before final consolidation. This preliminary action allows controlled extension and contact between structures while maintaining proper alignment and preventing void formation during the subsequent final bonding step that achieves full thermal conductivity.
Solution Approach 2:
A controlled gap or buffer zone is maintained between extending heat conductive structures during the bonding process, which prevents direct contact that would cause voids. This cushioning is gradually reduced as bonding progresses, allowing the structures to eventually contact and achieve full thermal conductivity without defect formation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances heat dissipation efficiency, prolongs the life span of the chip package, and effectively manages thermal stress between the chip and the heat dissipation lid, addressing the challenge of increasing heat in densely integrated semiconductor components.
Implementation Method 1
heat conductive structures and a ring dam are used to enhance heat dissipation by bonding a heat dissipation lid
Implementation Method 2
bonding a heat dissipation lid, with the ring dam constraining the heat conductive structures and allowing them to extend and contact each other during bonding
Data Source
AI summary
A method for forming a chip package structure is provided. The method includes disposing a chip package over a wiring substrate. The method includes forming a first heat conductive structure and a second heat conductive structure over the chip package. The first heat conductive structure and the second heat conductive structure are separated by a first gap. The method includes bonding a heat dissipation lid to the chip package through the first heat conductive structure and the second heat conductive structure. The first heat conductive structure and the second heat conductive structure extend toward each other until the first heat conductive structure contacts the second heat conductive structure during bonding the heat dissipation lid to the chip package.