Chip Package Light Shielding Layer Sidewall Extension

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Solution Overview

Problem

Existing chip packages face challenges in ensuring light shielding and moisture protection for optical devices, leading to potential defects and reduced reliability during the dicing process and in operational performance.

Innovation Solution

A chip package design featuring a substrate with a protection layer having openings for conducting bumps, where a light shielding layer is formed on the substrate and extends onto the sidewalls of the openings, providing effective light blocking and moisture prevention while ensuring a smooth surface for bump formation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a protection layer with openings is used to expose conducting bumps for electrical connection, then electrical connectivity is improved, but light interference and moisture ingress occur

Engineering Contradiction:

Improveelectrical connectivityVSAvoidlight interference and moisture ingress

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The protection layer is segmented into multiple regions: opened portions for electrical connection and light-shielded portions with reflective layers for light blocking. This segmentation allows simultaneous achievement of electrical connectivity and light interference prevention through functional zoning of the same layer structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

A reflective layer is introduced as an intermediary element within the protection layer structure. This reflective layer acts as a mediator that blocks light interference and moisture ingress while allowing electrical connection through the opened portions, thus resolving the contradiction between connectivity and protection.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If the protection layer completely covers the substrate for moisture protection, then moisture resistance is improved, but light shielding and bump formation become difficult

Engineering Contradiction:

Improvemoisture protectionVSAvoidbump formation and light shielding

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The protection layer exhibits local quality variation with different regions having different properties: opened portions for bump formation and light-shielded portions with reflective layers for light blocking. This local differentiation enables simultaneous achievement of moisture protection, light shielding, and ease of bump formation.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The solution moves from a two-dimensional planar protection layer to a three-dimensional structured protection layer with varying thickness, openings, and embedded reflective layers. This dimensional transformation allows multiple functions (moisture protection, light shielding, bump formation) to coexist in different spatial zones.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Object-affected harmful factors

If light shielding is enhanced by adding shielding layers, then light interference is reduced, but device complexity and manufacturing difficulty increase

Engineering Contradiction:

Improvelight interferenceVSAvoidstructure complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The reflective layer is merged into the protection layer structure, combining light shielding function with moisture protection function in a single integrated layer. This merging reduces device complexity compared to separate shielding layers while maintaining effective light interference prevention.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The protection layer is designed with multi-functionality: it provides moisture protection, light shielding through embedded reflective layers, and electrical connection through opened portions. This universal design reduces overall device complexity by consolidating multiple functions into a single layer structure.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution enhances the reliability and quality of chip packages by preventing light interference and moisture ingress, improving the operational performance and reducing defects during the dicing process.

Implementation Method 1

a light shielding layer formed on the protection layer and extending onto a sidewall of the opening of the protection layer

Methodology Applied

Scientific EffectLight blocking: Absorption (EM radiation)

Implementation Method 2

a protection layer formed on the second surface of the substrate... providing effective light blocking and moisture prevention

Methodology Applied

Scientific EffectMoisture barrier:

Data Source

PatentUS8536671B2Chip package

Publication Date: 2013.09.17 XINTEC INC

AI summary

According to an embodiment of the invention, a chip package is provided, which includes: a substrate having a first surface and a second surface; an optical device between the first surface and the second surface of the substrate; a protection layer formed on the second surface of the substrate, wherein the protection layer has at least an opening; at least a conducting bump formed in the opening of the protection layer and electrically connected to the optical device; and a light shielding layer formed on the protection layer, wherein the light shielding layer is further extended onto a sidewall of the opening of the protection layer.