Porous Liquid Metal Package Module for Short-Circuit-Safe Cooling
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Solution Overview
Problem
Conventional heat dissipation structures in electronic devices face challenges with liquid metal overflow, leading to short-circuit damage due to its high fluidity and inability to effectively dissipate heat from densely packed components, affecting reliability and service life.
Innovation Solution
An electronic package module with a porous carrying member clamped between the chip and heat-dissipation component, constraining liquid metal within a capillary-like structure to prevent overflow and ensure stable heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid metal is used as heat transfer medium between chip and heat-dissipation component, then heat dissipation performance is improved, but liquid metal overflows and causes short-circuit damage
Solution Approach 1:
The patent uses a porous carrying member (metal mesh or porous ceramic) with controlled pore size to contain the liquid metal. The porous structure provides capillary forces that retain the liquid metal within the pores while allowing thermal contact between the chip, carrying member, and heat-dissipation component, thus preventing overflow while maintaining heat dissipation performance.
Solution Approach 2:
The carrying member acts as an intermediary between the chip and heat-dissipation component. It provides a controlled environment for the liquid metal, allowing thermal transfer while physically constraining the liquid metal to prevent it from reaching surrounding electronic components and causing short circuits.
2Temperature
If conventional heat sink with fan is used, then heat dissipation is attempted, but tight component arrangement prevents effective heat discharge
Solution Approach 1:
The patent extracts the heat dissipation function from the conventional heat sink-fan assembly and integrates it directly into the chip package structure. The heat-dissipation component is embedded within the package module, eliminating the need for separate fan units and complex airflow paths, thereby achieving effective heat dissipation in tightly packed configurations.
Solution Approach 2:
The heat-dissipation component is nested within the electronic package module structure, with the carrying member containing liquid metal positioned between the chip and heat-dissipation component. This nested arrangement allows heat dissipation functionality to be integrated within the compact package without requiring additional external components.
3Temperature
If liquid metal is squeezed by heat sink, then heat transfer is enhanced, but liquid metal overflows to periphery of chip
Solution Approach 1:
The porous carrying member provides a structured matrix that confines the liquid metal within its pores. When the heat-dissipation component is pressed against the chip, the liquid metal is compressed within the porous structure rather than overflowing, maintaining both heat transfer efficiency and liquid metal containment through the capillary forces of the porous material.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The module effectively maintains heat dissipation performance while preventing short-circuit damage by retaining liquid metal between the chip and heat-dissipation component, ensuring continuous and stable heat transfer without overflow, thus enhancing the reliability and service life of electronic devices.
Implementation Method 1
the porous structure of the carrying member produces a capillary-like adsorption effect on the liquid metal, so that the liquid metal may be successfully retained in a space between the heat-dissipation component and the chip without overflowing
Implementation Method 2
the liquid metal may stably and continuously transmit the heat generated by the chip to the heat-dissipation component and then dissipate out of the electronic package module
Data Source
AI summary
The invention provides an electronic package module including a chip, a heat-dissipation component, a carrying member, and a liquid metal. The carrying member is clamped between the chip and the heat-dissipation component. The carrying member has a porous structure. The liquid metal is filled in the porous structure to be in thermal contact with the chip and the heat-dissipation component. The liquid metal is constrained between the chip and the heat-dissipation component by the carrying member and does not flow outside of the chip and the heat-dissipation component.