Chip Package Metal Heat Conductive Layer Thermal Management
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Solution Overview
Problem
Chip scale packages, such as image sensor chip packages, face heat dissipation issues that affect performance and can lead to noise and damage, as existing designs do not effectively manage heat generated by the semiconductor chip.
Innovation Solution
A chip package with a metal heat conductive layer on the lower surface and a bond pad on the upper surface for heat absorption and electrical connection, along with a metal heat conductive strip and solder balls or leads for efficient heat dissipation, optionally connected to a ground level for improved stability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If a chip scale package (CSP) is used to reduce package size, then the compactness and integration are improved, but heat dissipation capability deteriorates leading to temperature rise and performance degradation
Solution Approach 1:
The package structure is segmented into distinct functional layers: a reflective layer at the bottom for heat reflection, an insulating layer above it for thermal isolation, and a heat dissipation structure at the top surface for active heat management. This segmentation allows each layer to perform its specific function optimally while working together to solve the heat dissipation problem in a compact package.
Solution Approach 2:
The patent introduces a vertical dimensional arrangement of thermal management layers (reflective layer at bottom, insulating layer in middle, heat dissipation structure at top) rather than relying solely on lateral heat spreading. This dimensional approach enables effective heat management within the limited horizontal space of a CSP, addressing the temperature issue without increasing package footprint.
2Volume of moving object
If the package size is reduced to improve integration, then manufacturing complexity increases and heat management becomes more difficult
Solution Approach 1:
The manufacturing process is segmented into distinct steps: forming the reflective layer, adding the insulating layer, and creating the heat dissipation structure. This segmentation allows each manufacturing step to be optimized independently and enables modular production, reducing overall manufacturing complexity despite the compact package size.
3Loss of energy
If heat dissipation structures are added to improve thermal management, then the package complexity increases, but without such structures heat dissipation efficiency is insufficient
Solution Approach 1:
The heat dissipation structure serves multiple functions: it provides active heat dissipation from the semiconductor device, reflects remaining heat downward, and maintains the structural integrity of the package. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in package complexity while improving heat dissipation efficiency.
Solution Approach 2:
The reflective layer and insulating layer work together to create a thermal equipotential environment, directing heat flow in a controlled manner from the semiconductor device through the heat dissipation structure, thereby improving heat dissipation efficiency with minimal additional structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances heat dissipation efficiency, reduces operation temperature, and improves the performance of the semiconductor chip by effectively managing heat, thereby preventing noise and damage.
Implementation Method 1
a metal heat conductive layer formed on the lower surface, for conducting or absorbing heat generated by the semiconductor chip
Implementation Method 2
heat generated by a circuit of the semiconductor chip is conducted to the solder ball or the lead via the metal heat conductive layer and the metal heat conductive strip
Data Source
AI summary
A chip package includes: a semiconductor chip having an upper surface and a lower surface opposite to each other, the semiconductor chip including an image sensor circuit; a metal heat conductive layer formed on the lower surface, for conducting or absorbing heat generated by the semiconductor chip; a bond pad formed on the upper surface, for electrically connecting with the image sensor circuit in the semiconductor chip, wherein the metal heat conductive layer conducts or absorbs heat generated by the semiconductor chip, to thereby reduce temperature of the image sensor circuit in the semiconductor chip and improve the performance of the circuit, wherein the metal heat conductive layer entirely covers the lower surface.