Chip Package Metal Protection Layer for Adhesion and Oxidation Control
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Solution Overview
Problem
Current chip package technologies face challenges in achieving reliable adhesion and oxidation protection for metal surfaces, particularly in high-temperature environments, due to limitations in existing adhesion promotion methods that often rely on carcinogenic materials or provide inadequate moisture barriers.
Innovation Solution
A chip package design incorporating a metal protection layer structure with a low-temperature deposited oxide and a hydrothermally converted metal oxide layer, which acts as an adhesion promoter and oxidation protector, ensuring strong adhesion and moisture resistance while avoiding carcinogenic substances.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional adhesion promotion methods are used, then adhesion between metal surfaces and encapsulation material can be achieved, but carcinogenic materials (such as Cr-6) are required and oxidation protection is insufficient
Solution Approach 1:
The patent extracts and removes the harmful Cr-6 component from the adhesion promotion process by replacing the traditional electrochemical dendrite growth method with a hydrothermal conversion method that uses non-toxic aluminum oxide and silane-based adhesion promoters, thereby eliminating carcinogenic material exposure while maintaining adhesion reliability
Solution Approach 2:
The patent changes the chemical parameters of the adhesion promotion system by transitioning from chromium-based electrochemical processes to aluminum oxide-based hydrothermal processes with silane chemistry, fundamentally altering the material composition to remove carcinogenic elements while achieving equivalent or superior adhesion performance
2Strength
If metal surfaces are exposed for adhesion promotion, then encapsulation material can bond to metal, but oxidation and moisture damage occur
Solution Approach 1:
The patent applies preliminary protective action by forming a controlled aluminum oxide layer on the metal surface before encapsulation, which serves as both an adhesion promotion substrate and an oxidation barrier, preventing subsequent oxidation and moisture damage while enabling strong bonding
Solution Approach 2:
The patent creates a composite protective structure consisting of multiple layers including aluminum oxide, silane-based adhesion promoters, and encapsulation material, where each layer contributes specific functions (oxidation protection, adhesion promotion, mechanical bonding) to achieve both strong adhesion and comprehensive environmental protection
3Strength
If high temperature processing is used for adhesion promotion, then bonding strength increases, but metal oxidation accelerates
Solution Approach 1:
The patent creates an inert protective environment through the aluminum oxide layer and subsequent encapsulation that shields the metal surface from oxygen exposure during high-temperature processing, allowing bonding strength to increase through thermal treatment without accelerating oxidation due to the barrier properties of the protective layers
4Ease of manufacture
If electrochemical dendrite growth is used for adhesion, then cost-effective processing is achieved, but Cr-6 carcinogenic materials are required
Solution Approach 1:
The patent extracts the harmful Cr-6 component from the manufacturing process by replacing electrochemical chromium-based dendrite growth with hydrothermal aluminum oxide conversion and silane adhesion promotion, maintaining process simplicity and cost-effectiveness while eliminating carcinogenic substance use
Solution Approach 2:
The patent employs inexpensive, non-toxic materials such as aluminum oxide and silane-based compounds that can be applied through simple hydrothermal processes, replacing expensive and hazardous chromium-based materials while maintaining ease of manufacture and eliminating the need for complex hazardous material handling procedures
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced adhesion between metal regions and encapsulation materials, ensuring long-term reliability and protection against oxidation and moisture, even in hot environments, while reducing manufacturing costs through improved process control.
Implementation Method 1
a low-temperature deposited oxide
Implementation Method 2
a hydrothermally converted metal oxide layer
Data Source
AI summary
A chip package is provided. The chip package may include at least one chip, an exposed metal region and a metal protection layer structure over the exposed metal region and configured to protect the metal region from oxidation. The protection layer structure includes a low-temperature deposited oxide, and a hydrothermally converted metal oxide layer over the protection layer structure.