Injection Molding System for Chip Package with Overflow Prevention
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Solution Overview
Problem
The conventional chip package production process is complex and time-consuming, resulting in high costs and prolonged manufacturing times.
Innovation Solution
An injection molding system that simplifies the packaging process by using an inner cover with injection vias and runners, a molding tool, and a bottom plate, along with a filling material and an O-ring to prevent overflow, integrating multiple steps into a continuous process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional multi-step package process is used, then each layer can be produced separately with good quality control, but production time and cost increase significantly
Solution Approach 1:
The patent combines multiple separate packaging steps (substrate preparation, die bonding, wire bonding, molding, trimming, marking, plating, and inspection) into a single integrated injection molding process. The inner cover with pre-formed cavity and runner system allows all these operations to occur simultaneously during one molding cycle, dramatically reducing production time while maintaining quality through precise mold design and control.
Solution Approach 2:
The inner cover is pre-designed with the cavity and runner system before the molding process begins. This preliminary preparation of the mold structure enables the filling material to be injected directly into the precise location and shape needed, eliminating the need for subsequent separate steps for creating these features and reducing overall production time.
2Ease of manufacture
If conventional multi-step package process is used, then each operation can be performed with dedicated equipment, but manufacturing cost increases
Solution Approach 1:
The patent consolidates multiple dedicated manufacturing operations into a single injection molding process using an integrated mold system. The inner cover with cavity and runner allows substrate preparation, device mounting, wire bonding, molding, and other operations to occur in one continuous process, reducing the need for multiple dedicated equipment stations and lowering manufacturing costs.
Solution Approach 2:
The injection molding system performs multiple functions simultaneously: it acts as the substrate holder, the bonding apparatus, the molding tool, and the encapsulation system all in one process. This multi-functionality eliminates the need for separate dedicated equipment for each operation, reducing overall manufacturing complexity and cost.
3Productivity
If filling material is injected without overflow prevention, then injection speed can be increased, but material overflow occurs compromising package quality
Solution Approach 1:
The O-ring is pre-installed between the molding tool and inner cover before the injection process begins. This preliminary placement of the sealing element ensures that when high-speed injection occurs, the material is contained within the designated cavity without overflowing, maintaining package quality even at high injection speeds.
Solution Approach 2:
The O-ring acts as an intermediary sealing element between the molding tool and inner cover. It mediates the high-pressure injection process by providing a flexible seal that contains the filling material within the cavity while allowing the injection to proceed at high speed, thus preventing overflow without compromising productivity.
Data Source
AI summary
The injection molding system comprises a substrate, an inner cover, a molding tool, and a bottom plate. The substrate is used to locate at least one semiconductor device under molding and the inner cover with at least one first injection via, cavity and runner placed over the substrate. In addition, the molding tool includes at least one second injecting via aligned with the runner and the bottom plate is placed under the substrate. Furthermore, a filling material is filled into the cavity and runner of the inner cover during molding. In order to avoid overflowing the filling material, the system further comprises an O-ring placed between the molding tool and the inner cover. The inner radius of the O-ring corresponds with the inner radius of the injection via and is aligned with it.