Chip Package Structure With Switch Layer and Nested Protection
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Solution Overview
Problem
The challenge lies in integrating different elements to enhance the functionality and reliability of electronic devices, which is crucial for market competitiveness, but existing technologies have limitations in effectively combining these elements to improve performance and protection.
Innovation Solution
The proposed solution involves an electronic device structure comprising a chip, an element structure layer with a switch element, a redistribution structure layer, and a protective layer, where the chip has contacts connecting the switch element and redistribution structure layer, and the protective layer surrounds the chip and structure layers to enhance protection and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple elements (chip, element structure layer, redistribution structure layer) are integrated to enhance functionality, then device functionality and reliability are improved, but device complexity increases
Solution Approach 1:
The patent combines the chip, element structure layer, and redistribution structure layer into a single integrated device structure. The element structure layer is disposed adjacent to the chip's active surface, and the redistribution structure layer is disposed adjacent to the active surface, creating a merged architecture that improves reliability while managing complexity through unified design.
Solution Approach 2:
The protective layer is configured with a first portion that surrounds the chip and a second portion that surrounds the element structure layer and redistribution structure layer. This nested protective structure encloses multiple functional layers within a unified protective framework, enhancing reliability without proportionally increasing complexity.
2Reliability
If a protective layer surrounds the chip and structure layers to improve protection against environmental factors, then reliability is improved, but device complexity increases
Solution Approach 1:
The protective layer is divided into two distinct portions: a first portion that surrounds the chip and a second portion that surrounds the element structure layer and redistribution structure layer. This segmentation allows each portion to be optimized for its specific protective function while maintaining overall system reliability.
Solution Approach 2:
The protective layer serves multiple functions simultaneously: it provides mechanical protection, environmental sealing, and structural support for both the chip and the adjacent structure layers. This multi-functionality reduces the need for additional separate protective components, managing complexity while enhancing reliability.
Data Source
AI summary
An electronic device including a chip, an element structure layer, a redistribution structure layer and a protective layer is provided. The chip has an active surface and a plurality of contacts disposed on the active surface. The element structure layer is disposed adjacent to the active surface and has a switch element. The switch element is electrically connected to the chip through at least one of the plurality of contacts. The redistribution structure layer is disposed adjacent to the active surface and is electrically connected to the chip through at least one of the plurality of contacts. The protective layer includes a first portion and a second portion. The first portion surrounds the chip, and the second portion surrounds the element structure layer and the redistribution structure layer. A manufacturing method of an electronic device is also provided.