Chip Package Metal Oxide Coating for Adhesion and Oxidation Control
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Solution Overview
Problem
Current chip package technologies face challenges in achieving reliable adhesion and oxidation protection for metal surfaces, particularly in high-temperature environments, due to limitations in existing adhesion promotion methods that often rely on carcinogenic materials or provide inadequate moisture barriers.
Innovation Solution
A chip package design incorporating a metal protection layer structure with a low-temperature deposited oxide and a hydrothermally converted metal oxide layer, which acts as an adhesion promoter and oxidation protector, ensuring strong adhesion and resistance to moisture and oxidation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional adhesion promotion methods are used, then adhesion between metal surfaces and encapsulation material is achieved, but the method relies on carcinogenic materials or provides inadequate moisture barriers
Solution Approach 1:
The protection system is divided into multiple distinct layers: a first metal oxide layer for adhesion promotion and a second metal oxide layer for oxidation and moisture protection. This segmentation allows each layer to specialize in its function, eliminating the need for carcinogenic materials while maintaining adhesion reliability and providing adequate moisture barriers.
Solution Approach 2:
The invention uses composite metal oxide structures where different metal oxides are combined in specific layers. The first metal oxide layer (e.g., aluminum oxide) provides adhesion promotion, while the second metal oxide layer (e.g., silicon oxide or titanium oxide) provides oxidation and moisture protection. This composite approach achieves reliable adhesion without carcinogenic materials and adds superior environmental protection.
2Ease of manufacture
If metal surfaces are exposed for adhesion, then bonding to encapsulation material is enabled, but the metal surfaces are vulnerable to oxidation
Solution Approach 1:
The first metal oxide layer is formed on the metal surface before encapsulation bonding occurs. This preliminary formation of the oxide layer enables adhesion promotion while simultaneously protecting the underlying metal from oxidation during subsequent processing and service. The protective function is established in advance, preventing oxidation before it can occur.
Solution Approach 2:
The metal oxide layers serve as intermediary structures between the metal surface and the encapsulation material. The first metal oxide layer mediates adhesion bonding while the second metal oxide layer mediates protection from oxidation and moisture. These intermediary layers enable the metal to bond reliably without direct exposure to harmful environmental factors.
3Strength
If high-temperature processing is applied, then encapsulation bonding is strengthened, but metal surfaces undergo oxidation
Solution Approach 1:
The second metal oxide layer is formed beforehand to cushion and protect the metal surface from oxidation during high-temperature encapsulation processing. This protective layer acts as a barrier that prevents oxygen from reaching the metal surface even when exposed to elevated temperatures, allowing the encapsulation bonding to proceed without metal oxidation damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides enhanced adhesion between metal regions and encapsulation materials, while ensuring long-term protection against oxidation and moisture, even in hot environments, thereby improving the reliability and durability of chip packages.
Implementation Method 1
a low-temperature deposited oxide
Implementation Method 2
a hydrothermally converted metal oxide layer
Data Source
AI summary
A chip package is provided. The chip package may include at least one chip, an exposed metal region and a metal protection layer structure over the exposed metal region and configured to protect the metal region from oxidation. The protection layer structure includes a low-temperature deposited oxide, and a hydrothermally converted metal oxide layer over the protection layer structure.