Embedded Chip-Package Coding for Non-Destructive PCB Traceability

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Solution Overview

Problem

Conventional marking methods for semiconductor devices become invisible when embedded into a printed circuit board (PCB), making it impossible to identify or trace the embedded chip-package without damaging the circuit.

Innovation Solution

An embedded chip-package is designed with an information section that encodes information as a pattern of electrically conductive and insulating portions, allowing for non-destructive identification using X-ray or ultrasonic imaging.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of information

If conventional laser marking is used on the mold compound, then device identification is possible, but the marking becomes invisible when embedded into PCB

Engineering Contradiction:

Improvedevice identificationVSAvoidmarking visibility

Core Design Contradiction:

Loss of informationVSDifficulty of detecting and measuring

Solution Approach 1:

The patent replaces optical detection (laser marking visible to human eye) with physical property-based detection (X-ray or ultrasonic imaging). The marking is transformed from an optical feature to a physical structure that can be detected through imaging technologies that penetrate PCB materials.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent introduces an intermediary detection method (X-ray or ultrasonic imaging) that can penetrate the PCB material to reveal the embedded marking. This intermediary technology acts as a mediator between the hidden marking and the observer, allowing non-destructive detection.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Loss of information

If PCB layers are chemically etched to uncover the marking, then device identification is possible, but the circuit is damaged

Engineering Contradiction:

Improvedevice identificationVSAvoidcircuit integrity

Core Design Contradiction:

Loss of informationVSReliability

Solution Approach 1:

The patent performs the marking operation before embedding the device into the PCB. This preliminary action ensures the marking is in place before the device is concealed, eliminating the need for later destructive exposure methods.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent replaces destructive chemical etching with non-destructive imaging methods (X-ray or ultrasonic). This substitution allows information retrieval without compromising circuit integrity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Area of moving object

If the inlay size is reduced for small footprint applications, then power density increases, but marking visibility decreases

Engineering Contradiction:

Improvefootprint areaVSAvoidmarking readability

Core Design Contradiction:

Area of moving objectVSLoss of information

Solution Approach 1:

The patent replaces optical reading methods with imaging-based detection that is not limited by the small size of the inlay. X-ray and ultrasonic imaging can resolve fine features regardless of the small physical dimensions, maintaining information accessibility in miniaturized devices.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS20250079330A1Embedded chip-package, semiconductor package, method of forming an embedded chip-package, method of forming a semiconductor package, and method of analyzing an embedded chip-package or a semiconductor package

Publication Date: 2025.03.06 INFINEON TECHNOLOGIES AG

AI summary

An embedded chip-package is provided. In one example, the embedded chip-package includes a chip, an electrically insulating material at least partially encapsulating the chip, at least one metal layer configured to provide at least one electrically conductive connection to the chip, and an information section. The information section includes coded information about the embedded chip-package, wherein, in the information section, the information is coded as a pattern of electrically conductive portions and electrically insulating portions.