Chip Package Structure With Phase-Change Heat Dissipation
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Solution Overview
Problem
As chip performance improves, leading to increased power consumption and heat generation, existing technologies fail to effectively dissipate heat efficiently, potentially damaging the chip.
Innovation Solution
A chip package structure is developed with an energy storage material layer on the chip side, utilizing phase transition energy storage materials and heat conduction materials to absorb and dissipate heat, along with heat conduction support frames to enhance heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If chip performance is improved, then processing capability is enhanced, but heat generation increases
Solution Approach 1:
The patent utilizes phase transition energy storage materials (such as phase change materials that transition between solid and liquid states) to absorb heat from the chip. When the chip generates heat during operation, the phase transition material absorbs this thermal energy through its phase change process, effectively controlling the temperature rise while allowing the chip to maintain high performance.
Solution Approach 2:
The patent employs composite material structures combining different thermal management materials with the chip package. This includes integrating phase transition energy storage materials with heat conduction materials to create a composite thermal management system that simultaneously addresses heat absorption and heat dissipation, resolving the contradiction between high performance and heat generation.
2Ease of manufacture
If conventional packaging is used, then manufacturing is simple, but heat dissipation is insufficient
Solution Approach 1:
The patent incorporates phase transition energy storage materials into the packaging structure, utilizing their phase change properties to actively manage heat dissipation. This maintains manufacturing simplicity while dramatically improving thermal management compared to conventional packaging.
Solution Approach 2:
The patent introduces energy storage material layers as intermediary thermal management components between the chip and the external environment. These intermediary layers facilitate heat transfer and storage, improving heat dissipation capability without significantly complicating the manufacturing process.
3Temperature
If energy storage material layer is added, then heat dissipation is improved, but device complexity increases
Solution Approach 1:
The patent uses phase transition materials that passively absorb heat through their inherent phase change properties, requiring no additional active components or complex control systems. This improves heat dissipation while maintaining relatively simple device architecture.
Solution Approach 2:
The patent modifies thermal management by changing the physical state parameters of the energy storage materials (phase transitions) rather than adding complex mechanical or electronic control systems. This approach improves heat dissipation capability while minimizing increases in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively absorbs and dissipates heat generated by the chip, inhibiting temperature increases and extending the chip's service life by improving heat dissipation capabilities.
Implementation Method 1
utilizing phase transition energy storage materials and heat conduction materials to absorb and dissipate heat
Implementation Method 2
the energy storage material layer timely absorbs the heat generated by the chip
Implementation Method 3
heat conduction materials to absorb and dissipate heat
Data Source
AI summary
The present application provides a chip package structure and a fabrication method thereof, a memory and a memory system. The chip package structure includes a substrate, a chip on a side of the substrate, an energy storage material layer on a side of the chip opposite the substrate, and a package layer that includes a first portion covering the chip and a second portion covering the energy storage material layer. According to the present application, by disposing the energy storage material layer on a side of the chip, the energy storage material layer absorbs the heat generated by the chip, thereby improving the heat dissipation capability of the chip package structure for the chip.