Chip Package Structure Using Positioning Holes Instead of Hybrid Bonding
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Solution Overview
Problem
Conventional semiconductor packaging using hybrid bonding requires expensive special equipment for precise leveling and cleaning of inorganic passivation layers, leading to high packaging costs.
Innovation Solution
A package structure with a positioning layer made of organic insulating material and conductive bumps that are inserted into positioning holes, allowing for electrical connection without the need for precise surface flatness and cleanliness, thus eliminating the requirement for special equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If hybrid bonding method is used with inorganic passivation layers, then electrical connection between chips is achieved, but special expensive equipment is required for leveling and cleaning operations
Solution Approach 1:
The patent introduces an organic insulating layer as an intermediary between the inorganic passivation layers. This organic layer serves as a mediator that allows bonding without requiring the extreme surface precision needed for direct inorganic layer contact. The organic insulating layer with its higher elasticity and softer texture enables the metal pads to make reliable electrical contact even with moderate surface flatness, thereby eliminating the need for expensive special leveling and cleaning equipment.
Solution Approach 2:
The patent changes the material parameter of the insulating layer from inorganic (silicon dioxide) to organic material. This parameter change fundamentally alters the bonding requirements: organic materials have higher elasticity and can accommodate surface irregularities, allowing bonding processes to be performed with conventional equipment rather than requiring the ultra-precise special equipment needed for inorganic layer bonding.
2Reliability
If inorganic passivation layers are used for hybrid bonding, then chip electrical connection is achieved, but extremely high-precision special leveling equipment is required
Solution Approach 1:
The organic insulating layer acts as a compliant intermediary that absorbs surface irregularities. Its elastic properties allow it to deform and conform to minor surface variations, ensuring that the metal pads on opposing chips can achieve proper alignment and electrical contact without requiring the participating surfaces to be extremely flat, thus reducing the manufacturing precision requirements.
Solution Approach 2:
The patent creates a composite bonding interface by combining inorganic passivation layers with an organic insulating layer. This composite structure leverages the advantages of both material types: the inorganic layers provide electrical functionality while the organic layer provides mechanical compliance and surface tolerance, allowing reliable bonding with reduced surface flatness requirements.
3Reliability
If inorganic passivation layers are used for hybrid bonding, then chip electrical connection is achieved, but special cleaning equipment is required
Solution Approach 1:
The organic insulating layer serves as a forgiving intermediary that is more tolerant of cleaning imperfections compared to direct inorganic layer contact. Its elastic and compliant nature allows it to accommodate minor contaminants or surface defects that would otherwise prevent reliable bonding, thereby reducing the stringency and complexity of the cleaning process requirements.
4Reliability
If hybrid bonding with heating over 300°C is used, then metal pad expansion and electrical connection is achieved, but special heating equipment is required
Solution Approach 1:
The patent changes the material composition parameter by introducing organic insulating layers, which have different thermal properties than inorganic passivation layers. Organic materials generally have lower glass transition temperatures and can be processed at lower temperatures, allowing the bonding process to be performed with conventional heating equipment rather than requiring special equipment capable of sustained heating over 300°C.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly reduces packaging costs by allowing the use of conventional equipment and simplifying the bonding process, making it more viable for widespread use in electronic products.
Implementation Method 1
the metal pads 102, 112 are heated (about 300° C.), such that the metal pads 102, 112 are expanded to contact each other for electrical connection
Data Source
AI summary
A package structure is provided, in which a second electronic element having a plurality of conductive bumps is stacked on a first electronic element arranged with a positioning layer. The plurality of conductive bumps are inserted into a plurality of positioning holes of the positioning layer, and the second electronic element is bonded onto the positioning layer and electrically connected to the first electronic element via the plurality of conductive bumps, such that the hybrid bonding technology is replaced via the arrangement of the positioning holes and the conductive bumps, thereby reducing packaging costs.