Semiconductor Chip Package Power Rings and Lead Frame
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Solution Overview
Problem
Conventional multi-chip package structures have complex power net layouts and high fabrication costs due to fixed bonding pad positions and the use of costly Ball Grid Array (BGA) substrates, limiting their integration density and flexibility.
Innovation Solution
A semiconductor chip package structure with a first chip having power rings and bonding pads in a marginal region, allowing for flexible electrical connections to a second chip, eliminating the need for a BGA substrate by using a lead frame based package with power rings that can be positioned under bonding pads for reduced layout area and lower fabrication costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a BGA substrate is used for the conventional multi-chip package structure, then electrical connections can be established, but fabrication costs increase
Solution Approach 1:
The patent replaces the expensive BGA substrate with a lead frame structure that uses inexpensive bonding pads and wire bonds. The lead frame serves as a cost-effective alternative substrate that achieves the same electrical connection function without the high fabrication costs associated with BGA technology.
Solution Approach 2:
The patent extracts and eliminates the BGA substrate from the package structure, retaining only the essential electrical connection function through bonding pads and wire bonds. This removal of the expensive BGA component directly reduces fabrication costs while maintaining electrical connectivity.
2Reliability
If bonding pad positions are fixed to connect to different operating powers through segment power net, then power distribution is achieved, but layout area increases
Solution Approach 1:
The patent makes the power distribution system flexible by allowing bonding pads to be positioned dynamically at different locations on the lead frame. Instead of fixed segment power nets, the bonding pads can be strategically placed to connect to different power connections, enabling adaptive power distribution that reduces layout area while maintaining reliability.
Solution Approach 2:
The patent transitions from a two-dimensional fixed grid layout to a more flexible spatial arrangement where bonding pads can be positioned in three-dimensional space on the lead frame. This allows power connections to be made at optimal locations without being constrained by rigid row-column grid patterns, thereby reducing overall layout area.
3Adaptability or versatility
If multiple power connections are implemented for different operating powers, then multi-function performance is achieved, but device complexity increases
Solution Approach 1:
The lead frame structure serves multiple functions simultaneously: it provides mechanical support, electrical connection, and power distribution through integrated bonding pads. This universal structure eliminates the need for separate complex power net layers, reducing overall device complexity while maintaining multi-function performance.
Solution Approach 2:
The patent merges the power distribution function with the mechanical support structure by integrating bonding pads directly into the lead frame. This consolidation combines multiple functions into a single integrated structure, reducing the number of separate components and simplifying the overall device architecture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables a high-density, cost-effective multi-chip package with flexible power connections, reducing the layout area and fabrication costs while maintaining efficient power distribution between chips, thus overcoming the limitations of conventional structures.
Implementation Method 1
A plurality of second bonding wires are electrically connected to the power bonding pads and the second power bonding pads, respectively
Data Source
AI summary
A semiconductor chip package structure is described. The semiconductor chip package structure comprises a first chip, which is operated through a first power connection, having a central region and a marginal region. The first chip comprises a plurality of first and second power bonding pads disposed in a marginal region on the top of the first chip. A first power ring and a second power ring are disposed on the first chip, wherein the first and second power rings are respectively electrically connected to the first and second power bonding pads. A second chip, which is operated through a second power connection, is mounted on the central region of the first chip, wherein the second chip comprises a plurality of power bonding pads thereon. A plurality of second bonding wires are electrically connected to the power bonding pads and the second power bonding pads, respectively.