Embedded Chip Package Protruding Section for Warpage Prevention
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Solution Overview
Problem
Conventional embedded chip package structures face issues such as warpage due to thermal stress, increased size and cost, and compatibility challenges with different chip sizes, which hinder miniaturization and multi-functional designs.
Innovation Solution
An embedded chip package structure featuring a supporting board with protruding sections of varying thickness to balance thermal stress, allowing for flush electrical connections and efficient heat dissipation, while integrating multiple semiconductor chips for improved performance and reduced fabrication complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the thickness of the heat spreader is increased to balance thermal stress, then warpage prevention is improved, but package volume and fabrication cost increase
Solution Approach 1:
The heat spreader is segmented into a first heat spreader portion and a second heat spreader portion with different thicknesses. The first portion has greater thickness for enhanced heat dissipation, while the second portion has reduced thickness to minimize package volume and cost, resolving the contradiction between warpage prevention and volume reduction.
Solution Approach 2:
Different regions of the heat spreader are given different thicknesses to match local requirements. The region requiring thermal management (first portion) has greater thickness, while regions requiring miniaturization (second portion) have reduced thickness, achieving both warpage prevention and volume reduction simultaneously.
2Adaptability or versatility
If different sizes of chips are embedded in a substrate, then multi-function module integration is improved, but surface flatness deteriorates due to uneven electrical connecting surfaces
Solution Approach 1:
The solution moves from a single-plane mounting approach to a multi-level approach using protruding sections of different heights. Chips of different sizes can be mounted on protruding sections at different vertical levels, allowing their electrical connecting surfaces to be flush while accommodating size variations, thus maintaining surface flatness for subsequent circuit processes.
Solution Approach 2:
Protruding sections serve as intermediary structures between the substrate and chips of different sizes. These protruding sections with varying heights act as adaptive mounting platforms that enable flush alignment of electrical connecting surfaces despite chip size differences, preserving manufacturing precision for fine circuit processes.
3Ease of manufacture
If a conventional embedded chip package structure is used, then manufacturing simplicity is maintained, but thermal stress causes warpage and layer delamination
Solution Approach 1:
The thickness parameter of the heat spreader is changed across different regions (first portion vs. second portion) to balance thermal stress distribution. This parameter variation allows the structure to accommodate thermal expansion differences without warpage or delamination, improving structural stability while maintaining manufacturability through standard PCB techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution prevents warpage, reduces package thickness and cost, facilitates multi-chip module integration, and enhances heat dissipation, leading to improved electrical performance and reliability.
Implementation Method 1
Since there exists a big difference between CTEs (Coefficient of Thermal Expansion) of the heat spreader 12 and the dielectric layer 14, different thermal stresses generated while temperature changes in fabricating processes such as substrate baking and thermal cycle processing can lead to warpage of the package structure
Implementation Method 2
heat produced by a semiconductor chip is accordingly increased. If heat can not be dissipated efficiently, the lifetime and performance of the semiconductor chip can seriously be reduced
Data Source
AI summary
An embedded chip package structure is proposed. The embedded chip package structure includes a supporting board with a protruding section, a semiconductor chip formed on the protruding section of the supporting board, a dielectric layer formed on the supporting board and the semiconductor chip, and a circuit layer formed on the dielectric layer. The circuit layer is electrically connected to electrode pads of the semiconductor chip via a plurality of conducting structures formed inside the dielectric layer such that the semiconductor chip can be electrically connected to an external element through the circuit layer. By varying the thicknesses of the protruding section, the dielectric layer and the supporting board, warpage of the package structure resulted from temperature change during the fabrication process can be prevented.