Chip Package Recess Structure for Heat Dissipation and Strength
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Solution Overview
Problem
The existing chip package structures face a challenge in balancing heat dissipation capability and structural strength, as thinner insulation materials enhance heat dissipation but compromise structural integrity and resistance to physical shocks.
Innovation Solution
A chip package structure with a recess structure on its outer surface, featuring grooves and holes, increases heat dissipation area without reducing overall thickness, ensuring sufficient structural strength and preventing damage from physical shocks.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the insulation material thickness is reduced to enhance heat dissipation capability, then the heat dissipation capability is improved, but the structural strength and resistance to external physical shock deteriorate
Solution Approach 1:
The patent introduces a recess structure on the outer surface of the package body, transforming a two-dimensional surface into a three-dimensional structure. This increases the heat dissipation area without reducing the overall thickness of the insulation material, thereby improving heat dissipation capability while maintaining structural strength.
2Temperature
If the insulation material thickness is reduced to enhance heat dissipation capability, then the heat dissipation capability is improved, but the resistance to external physical shock deteriorates
Solution Approach 1:
By adding a recess structure on the outer surface, the patent increases heat dissipation area without compromising the overall thickness of the insulation material. This maintains the package body's resistance to external physical shock while enhancing heat dissipation capability.
3Temperature
If the heat dissipation area is increased by adding surface features, then the heat dissipation capability is improved, but the device complexity increases
Solution Approach 1:
The recess structure is divided into multiple grooves and holes that can be independently designed and manufactured. This segmentation allows for increased heat dissipation area while keeping each individual feature simple, thereby reducing overall manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The recess structure effectively enhances heat dissipation while maintaining structural integrity, allowing the chip package to withstand physical shocks without damage, and improves heat dissipation efficiency by increasing the surface area in contact with air.
Implementation Method 1
A recess structure 31 is provided on an outer surface of the package body 30. The recess structure 31 is configured to increase a heat dissipation area of the package body 30.
Data Source
AI summary
The chip package structure includes a bare chip, a bare chip carrier, and a package body. The bare chip is located on one side of the bare chip carrier. The package body covers the bare chip to package the bare chip on the bare chip carrier. A recess structure is provided on an outer surface of the package body. The recess structure is configured to increase a heat dissipation area of the package body. The recess structure increases a surface area of the package body, and therefore increases the heat dissipation area of the package body, thereby enhancing a heat dissipation capability of the package body.