Chip Package Structure With Recessed 2D Code for Damage Resistance
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional chip package structures have recognition codes printed on the top side of the encapsulant, which are not coplanar and thus prone to damage, leading to unrecognizability.
Innovation Solution
A chip package structure with a substrate, chip module, encapsulant, and recognition contrast layer, where the encapsulant has a patterned trench for a 2D code pattern and the recognition contrast layer is filled in, ensuring coplanarity and different colors conforming to ISO/IEC 15415 standards, forming a planar 2D code pattern that is resistant to damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the recognition code is printed on the top side of the encapsulant, then the recognition code can be easily applied, but the recognition code is not coplanar with the top side and is prone to damage
Solution Approach 1:
The invention transitions from a two-dimensional printed code on the surface to a three-dimensional recessed structure filled with contrast material. The patterned trench creates a physical dimension (depth) that allows the recognition code to be recessed into the encapsulant, making it coplanar and damage-resistant while maintaining manufacturability through molding processes.
2Ease of manufacture
If the recognition code is printed on the top side of the encapsulant, then the application process is simple, but the recognition accuracy may be compromised due to non-coplanar surface
Solution Approach 1:
By introducing the vertical dimension through patterned trenches, the invention creates a coplanar surface for the recognition code that ensures consistent optical reflection and scanning conditions, thereby improving recognition accuracy while maintaining manufacturing simplicity through integrated molding.
Solution Approach 2:
The invention utilizes color contrast between the recognition code material and the encapsulant body. The patterned trench is filled with material having different optical properties (color), creating a high-contrast visual pattern that enhances recognition accuracy while the recessed structure maintains coplanarity.
3Reliability
If a patterned trench is created and filled with recognition contrast layer, then the 2D code pattern becomes coplanar and damage-resistant, but the manufacturing process becomes more complex
Solution Approach 1:
The invention merges the recognition code formation process with the encapsulant molding process. The patterned trench and contrast layer are integrated into the same manufacturing cycle, eliminating separate printing or marking steps and reducing overall manufacturing complexity despite the added structural feature.
Solution Approach 2:
The patterned trench is formed as a preliminary feature during the molding process, before the contrast material is added. This preliminary action of creating the recessed structure enables subsequent easy filling with contrast material, simplifying the overall process compared to post-manufacturing code application methods.
Data Source
AI summary
A chip package structure and a package module thereof are provided. The package module includes an encapsulant and a recognition contrast layer. The encapsulant has a patterned trench that is recessed in a top surface thereof and that corresponds in shape to a predetermined two-dimensional (2D) code pattern. The recognition contrast layer is filled in the patterned trench. The recognition contrast layer and the top surface of the encapsulant respectively have different colors that conform to grade A or grade B in the ISO/IEC 15415 standard. The recognition contrast layer is coplanar with the top surface of the encapsulant so as to jointly form the predetermined 2D code pattern having a planar shape.