Chip Package Surface Smoothness via Recessed Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional chip packaging methods result in poor smoothness of the chip package, leading to unreliable chip performance due to inadequate alignment and connection of chips with circuit boards.
Innovation Solution
A chip packaging method involving a plastic packaging layer with a first and second surface, where the chip is flush with the first surface, and an interconnection structure on the second surface connects the chip to an external circuit, ensuring accurate alignment and robust mechanical strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional chip packaging methods are used, then the packaging process can be completed, but the smoothness of the chip package surface is poor
Solution Approach 1:
The patent applies preliminary action by pre-forming recesses in the circuit board at the chip mounting positions before chip placement. This preliminary preparation ensures that chips are mounted at precise, uniform depths, creating a flush surface that improves both surface smoothness and connection reliability. The recesses are formed in advance to accommodate chip thickness variations and ensure consistent surface alignment.
Solution Approach 2:
The patent changes the geometric parameters of the circuit board by introducing controlled recesses at chip mounting locations. This parameter modification allows chips to be embedded at uniform depths despite variations in chip thickness, thereby achieving a smooth package surface while maintaining reliable electrical connections through the interconnection structures.
2Manufacturing precision
If chips are mounted on a flat circuit board surface, then the mounting process is simple, but the alignment precision and connection reliability are poor
Solution Approach 1:
The circuit board is prepared in advance with precisely positioned recesses at each chip mounting location. This preliminary action establishes accurate reference positions for chip placement, ensuring high alignment precision without complicating the overall packaging process. The recesses serve as built-in positioning features that guide chip placement.
Solution Approach 2:
The recesses in the circuit board act as intermediary structures that mediate between the chip and the board surface. These recesses provide a controlled interface that ensures precise alignment and uniform chip embedding depth, improving connection reliability while maintaining a relatively simple packaging structure.
3Adaptability or versatility
If chips of different thicknesses are mounted, then various chip specifications can be accommodated, but the surface smoothness and component height consistency are poor
Solution Approach 1:
The circuit board is designed with local variations in surface topology through the recesses. Each recess is customized to accommodate the specific chip thickness at that location, allowing the board to adapt to different chip specifications while maintaining a uniform flush surface. This local adaptation ensures that chips of varying thicknesses all sit at the same height relative to the board surface.
Solution Approach 2:
The patent changes the local geometric parameters of the circuit board by creating recesses with varying depths corresponding to different chip thicknesses. This parameter adjustment allows chips of different specifications to be mounted with their surfaces flush with the board, achieving both adaptability and height consistency.
4Reliability
If a rigid mounting structure is used, then mechanical strength is high, but the smoothness and reliability of chip connections are poor
Solution Approach 1:
The recesses are pre-formed in the circuit board to precisely accommodate chip dimensions, ensuring that chips are mechanically secured at optimal positions. This preliminary structural preparation provides both the smooth surface needed for reliability and the mechanical strength needed for robust connections, as chips are firmly held in their recesses.
Solution Approach 2:
The recesses serve as intermediary structures that provide both mechanical support and surface alignment. These recesses firmly anchor chips in position (providing mechanical strength) while simultaneously ensuring their surfaces are flush with the board (providing smoothness for reliable connections).
Data Source
AI summary
A chip packaging method and a chip package are provided. According to the chip packaging method and the chip package, to-be-packaged chips are located in a plastic packaging layer, and front surfaces of the to-be-packaged chips are flush with a first surface of the plastic packaging layer, and the plastic packaging material for manufacturing the plastic packaging layer has good plasticity before a curing process, so that the formed first surface and the second surface have good smoothness, thereby ensuring the reliability of the package.