Chip Package Reinforcing Layer Integration for Strength and Thickness
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Solution Overview
Problem
The challenge is to enhance the strength of chip packages and simplify the manufacturing process, particularly for miniaturized and thinned fingerprint recognition sensor packages, while maintaining durability and reducing thickness.
Innovation Solution
A chip package design incorporating a reinforcing layer on the non-active surface of the chip, integrated with a molding layer, and a structure that includes upper and lower wiring portions connected via mold vias, with a polyimide molding layer that eliminates the need for a separate insulating layer, allowing direct formation of wiring layers and reducing package thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If a chip package is miniaturized and thinned to meet electronic device requirements, then the package size and thickness are reduced, but the structural strength and durability deteriorate
Solution Approach 1:
The patent applies composite materials by integrating a reinforcing layer made of metal (such as stainless steel, Cu, Ag, Au, W, Pt, or Cr) or polymer materials onto the chip structure. This reinforcing layer is then encapsulated together with the chip to form an integrated package structure, providing enhanced mechanical strength and durability while maintaining the thinned profile required for modern electronic devices
2Strength
If a reinforcing layer is added to improve package strength, then the durability is enhanced, but the manufacturing process complexity increases
Solution Approach 1:
The patent merges the reinforcing layer integration process with the existing chip encapsulation process. The reinforcing layer is formed on the chip, and then the encapsulation material is applied to encapsulate both the chip and the reinforcing layer simultaneously, creating an integrated structure that reduces the number of separate manufacturing steps and simplifies the overall production process
3Reliability
If multiple separate layers (insulating layer, wiring layer, molding layer) are used to achieve electrical connections and protection, then the electrical functionality is ensured, but the package thickness increases
Solution Approach 1:
The patent combines the functions of the insulating layer, wiring layer, and molding layer into a single integrated molding layer structure. The molding layer is configured to provide both electrical insulation and mechanical protection, while wiring portions are formed within or on the molding layer to establish electrical connections, thereby eliminating the need for multiple separate layers and reducing overall package thickness
Data Source
AI summary
Disclosed are a chip package capable of improving the strength of a package and simplifying a manufacturing process and a manufacturing method therefor. This invention may improve the durability of the package by further forming a reinforcing layer on a chip by using an adhesive layer and molding the chip and the reinforcing layer so as to be integrated by using a molding layer. Also, the strength of the package may be improved by having a structure in which solder balls are formed between a base substrate and a re-wiring layer and integrated with the molding layer, and a wiring layer may be formed directly on the molding layer by using polyimide (PI) as the molding layer without using a separate insulating layer formed on the molding layer as in the conventional art.