Chip Package Resin Cavity for Stable Transparent Plate Mounting
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Solution Overview
Problem
Existing integrated circuit chip packages face challenges in the secure and efficient mounting of transparent plates and the formation of cavities for pixels, leading to potential displacement and interference issues.
Innovation Solution
A method involving the formation of resist layers with specific openings and the use of a transparent plate with no glue, where the plate's periphery rests on a resin layer, ensuring secure positioning and preventing displacement, while the resin covers the chip's periphery to prevent dendrite formation and foreign body deposition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a transparent plate is mounted above the chip using conventional methods, then the plate can be positioned over the pixel array, but the plate may be displaced or improperly positioned due to lack of secure mounting structure
Solution Approach 1:
The resin layer is applied to the support surface before the transparent plate is positioned, creating a pre-prepared mounting surface that secures the plate upon contact. This preliminary preparation eliminates the need for complex post-positioning adjustment mechanisms while ensuring stable mounting.
Solution Approach 2:
A resin layer is introduced as an intermediary substance between the support and the transparent plate. This resin layer provides adhesive bonding that secures the plate in position, resolving the contradiction between simple structure and reliable mounting by using a chemical intermediary rather than mechanical fastening.
2Volume of stationary object
If the transparent plate is positioned close to the chip to minimize cavity size, then the package volume is reduced, but the plate may interfere with the chip's peripheral components or dendrite formation
Solution Approach 1:
The resin application is segmented into different zones: a first resin layer covers the peripheral area to prevent dendrite formation, while a second resin layer is applied only in the central region where the plate contacts the support. This segmentation allows the plate to be positioned close to the chip without interfering with peripheral components.
Solution Approach 2:
The resin is applied with different properties in different locations: the first resin layer in the periphery has dendrite-preventing properties, while the second resin layer in the contact area provides mechanical support and positioning. This local differentiation resolves the conflict between compact packaging and functional protection.
3Reliability
If conventional encapsulation methods are used with ring-shaped walls, then the cavity is defined and protected, but the manufacturing process becomes more complex and time-consuming
Solution Approach 1:
The complex ring-shaped wall structure is extracted and replaced with a simple resin layer application. The resin layer performs the cavity-defining function without requiring the fabrication and assembly of physical wall structures, thereby simplifying the manufacturing process and increasing productivity while maintaining reliable cavity definition.
Solution Approach 2:
The mechanical ring-shaped wall structure is replaced with a chemical/resin-based system. The resin layer defines the cavity through its material presence and adhesion properties rather than through mechanical walls, eliminating complex machining and assembly steps while maintaining cavity integrity.
4Reliability
If the transparent plate is held securely above the chip, then displacement is prevented, but the mounting structure may interfere with light transmission to the pixels
Solution Approach 1:
The resin layer serves as an intermediary that provides mechanical support and positioning stability for the transparent plate while being optically transparent. This allows the plate to be securely mounted without the support structure interfering with light transmission to the pixel array.
Solution Approach 2:
The resin is applied locally only where mechanical support is needed (at the plate's contact points with the support), leaving the central optical path clear. This localized application provides stable positioning while minimizing interference with light transmission to the pixels.
Data Source
AI summary
A method of fabricating a package for an integrated circuit chip, includes: a) mounting the integrated circuit chip to a support; b) forming a first resist layer over the integrated circuit chip which has a first opening emerging onto a central portion of the integrated circuit chip; c) forming a second resist layer over the first resist layer which has a second opening having a central portion emerging onto the first opening and a peripheral portion emerging onto the first layer; d) arranging a transparent plate in the second opening; and e) forming a third resist layer over the second resist layer and transparent plate which has a third opening emerging onto a central portion of the transparent plate.