Chip Package Ring Dam Structure for Void-Free Heat Dissipation
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Solution Overview
Problem
The increasing integration density of semiconductor devices leads to higher heat generation, posing a challenge for efficient heat dissipation in chip package structures, which existing technologies have not adequately addressed.
Innovation Solution
A chip package structure is formed with heat conductive structures and a ring dam, where the heat conductive structures are bonded to a heat dissipation lid, and the ring dam constrains these structures to prevent void formation and enhance heat dissipation efficiency, using materials like metal foils and polymers with thermal conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If integration density of semiconductor devices is increased, then more components can be integrated into a given area, but heat generation increases and heat dissipation efficiency deteriorates
Solution Approach 1:
The patent divides the heat dissipation function into multiple segments: heat conductive structures (including heat spreaders and heat sinks) are segmented and arranged in an array over the chip package, with each segment handling heat from specific regions. This segmentation allows more comprehensive heat coverage without increasing individual component complexity.
Solution Approach 2:
The patent transitions from two-dimensional heat dissipation (flat heat sinks on chip surface) to three-dimensional heat dissipation by adding vertical heat conductive structures that extend upward from the chip package. This dimensional change increases the heat dissipation surface area without occupying additional planar space, enabling effective heat management despite high integration density.
2Temperature
If heat conductive structures are applied to improve heat dissipation, then thermal management efficiency is improved, but the structures may overflow or form voids during bonding processes
Solution Approach 1:
The patent applies preliminary anti-action by using the ring dam to pre-constrain the heat conductive structures before bonding occurs. The ring dam is positioned around the heat conductive structures to prevent their outward movement during the bonding process, counteracting the potential overflow effect before it can compromise bonding precision.
Solution Approach 2:
The ring dam serves as an intermediary element between the heat conductive structures and the bonding process. It mediates the interaction by providing a physical barrier that allows the bonding process to proceed without the heat conductive structures interfering through overflow, thus ensuring both heat dissipation functionality and bonding precision.
3Manufacturing precision
If ring dam is added to constrain heat conductive structures, then manufacturing precision is improved, but device complexity increases
Solution Approach 1:
The ring dam is implemented as a thin film or shell structure that provides constraining functionality without adding substantial bulk or complexity. This thin-film approach maintains manufacturing precision while minimizing the increase in device complexity, as the ring dam can be integrated into the existing layered structure of the chip package.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves heat dissipation efficiency and extends the life span of the chip package by ensuring effective thermal management and preventing heat conductive structure outflow during bonding processes.
Implementation Method 1
heat conductive structures are bonded to a heat dissipation lid... using materials like metal foils and polymers with thermal conductivity
Implementation Method 2
the ring dam constrains these structures to prevent void formation and enhance heat dissipation efficiency
Data Source
AI summary
A chip package structure is provided. The chip package structure includes a wiring substrate. The chip package structure includes a chip package over the wiring substrate. The chip package structure includes a first heat conductive structure over the chip package. The chip package structure includes a ring dam over the chip package and surrounding the first heat conductive structure. The first heat conductive structure has a first corner portion and a first protruding portion connected to the first corner portion, and the first protruding portion passes through the ring dam. The chip package structure includes a heat dissipation lid over the first heat conductive structure and the ring dam.