Chip Package Integrating Sensing and IC on Single Substrate

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Solution Overview

Problem

The existing chip packaging process limits the miniaturization of electronic products due to the separate and independent disposition of sensing and integrated circuit chips on printed circuit boards, making it difficult to reduce the size of electronic devices.

Innovation Solution

A chip package design that integrates a sensing device and an integrated circuit device on a single substrate using a redistribution layer for electrical connection, with an insulating layer and conducting structures to facilitate compact packaging, allowing for the integration of multiple functions in a smaller form factor.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If sensing device and integrated circuit device are separately disposed on printed circuit board, then electrical connection can be established, but the size of printed circuit board cannot be reduced

Engineering Contradiction:

Improvesize of printed circuit boardVSAvoidseparate disposition structure

Core Design Contradiction:

Volume of moving objectVSDevice complexity

Solution Approach 1:

The patent merges the sensing device and integrated circuit device onto a single substrate, eliminating the need for separate discrete components and their interconnections. This consolidation directly reduces the overall size of the printed circuit board while maintaining all necessary electrical connection functions through integrated routing layers.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent transitions from a planar two-dimensional layout of separate components to a three-dimensional stacked architecture where the sensing device and integrated circuit device are vertically arranged on different layers of the substrate. This dimensional change enables compact integration while preserving electrical connectivity through vertical vias and redistribution layers.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Volume of moving object

If multiple chips are integrated on single substrate, then miniaturization is achieved, but manufacturing process complexity increases

Engineering Contradiction:

Improveform factor of electronic productVSAvoidwafer-level packaging process

Core Design Contradiction:

Volume of moving objectVSEase of manufacture

Solution Approach 1:

The patent performs preliminary integration of the sensing device and integrated circuit device onto the substrate during the wafer fabrication process itself, before final packaging. This preliminary action on the wafer level enables subsequent batch processing and assembly operations to be performed more efficiently, reducing overall manufacturing complexity despite the integrated architecture.

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS10157875B2Chip package and method for forming the same

Publication Date: 2018.12.18 XINTEC INC

AI summary

A chip package including a first substrate is provided. The first substrate includes a sensing device. A second substrate is attached onto the first substrate and includes an integrated circuit device. A first conductive structure is electrically connected to the sensing device and the integrated circuit device through a redistribution layer disposed on the first substrate. An insulating layer covers the first substrate, the second substrate and the redistribution layer. The insulating layer has a hole therein and a second conductive structure is disposed under the bottom of the hole. A method for forming the chip package is also provided.