Chip Package Heat Dissipation Plate for Reliable Shield Grounding
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Solution Overview
Problem
Existing chip packaging structures with metal shielding layers are prone to over-plating, contaminating solder balls and experiencing grounding connection failures due to non-uniform plating thickness and the need for the shielding layer to extend to the second surface for connection.
Innovation Solution
A chip packaging structure featuring a metal heat dissipation plate connected to the substrate through a conductive connector, which allows the metal shielding layer to be electrically connected to the grounding pin without extending to the second surface, and includes fixed connectors for enhanced connection strength between the heat dissipation plate and the chip, reducing warpage and deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the metal shielding layer is formed by sputtering the surface of the packaging structure and extending to the second surface to connect to the grounding pin, then the electromagnetic shielding function is achieved, but the solder ball is contaminated due to over-plating and grounding connection fails due to non-uniform plating thickness
Solution Approach 1:
The patent divides the grounding connection path into two separate segments: (1) the metal shielding layer on the plastic packaging layer connects to the heat dissipation plate, and (2) the heat dissipation plate connects to the grounding pin on the substrate. This segmentation prevents the metal shielding layer from directly extending to the second surface, thereby avoiding solder ball contamination while maintaining grounding reliability through the heat dissipation plate as an intermediate connection point
Solution Approach 2:
The heat dissipation plate serves as an intermediary component between the metal shielding layer and the grounding pin. The metal shielding layer connects to the heat dissipation plate on the first surface, which then provides a reliable grounding connection to the grounding pin, eliminating the need for the shielding layer to extend to the second surface and preventing solder ball contamination
2Reliability
If the metal shielding layer extends to the second surface to connect to the grounding pin, then the grounding connection is established, but the plating layer thickness becomes non-uniform causing grounding connection failure
Solution Approach 1:
The patent extracts the grounding connection function from the metal shielding layer structure. Instead of relying on the shielding layer to extend and provide grounding, the design separates the shielding function (metal layer on plastic packaging) from the grounding function (heat dissipation plate connected to grounding pin), allowing the shielding layer to be limited to the first surface without compromising grounding reliability
Solution Approach 2:
The heat dissipation plate acts as an intermediary that provides a dedicated, reliable grounding connection path independent of the metal shielding layer's plating quality. This mediator ensures consistent grounding connection through mechanical or thermal bonding rather than relying on uniform plating thickness
3Temperature
If the heat dissipation plate is connected to the substrate through thermal interface material only, then the thermal conduction is achieved, but the connection strength is insufficient leading to warpage and deformation
Solution Approach 1:
The patent merges the thermal conduction function and the mechanical connection function into a single integrated structure. The heat dissipation plate is directly bonded to the substrate through conductive connectors that provide both strong mechanical attachment (preventing warpage and deformation) and effective thermal conduction (dissipating heat from the chip), eliminating the need for separate weak thermal interface material connections
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration prevents solder ball contamination, enhances product yield and reliability by ensuring reliable grounding and reducing the risk of connection failures, while increasing the connection strength between the heat dissipation plate and the substrate and chip.
Implementation Method 1
a thermal interface material is filled between the heat dissipation plate and the chip
Implementation Method 2
the heat dissipation plate is connected to the first surface of the substrate through a conductive connector and electrically connected to the grounding pin
Implementation Method 3
a metal shielding layer is disposed on a surface of the plastic packaging layer
Data Source
AI summary
The present invention provides a chip packaging structure having a heat dissipation plate and a manufacturing method thereof. The packaging structure includes a substrate, at least one chip, the heat dissipation plate, a plastic packaging layer and a metal shielding layer, wherein the heat dissipation plate is bonded to a first surface of the substrate, a thermal interface material is filled between the heat dissipation plate and the chip, the heat dissipation plate is connected to the first surface, and a connection strength between the conductive connector and the substrate and the heat dissipation plate is greater than a connection strength between the thermal interface material and the chip and the heat dissipation plate; the plastic packaging layer exposes at least part of a surface region of the heat dissipation plate; and the metal shielding layer is at least connected to the surface region.