Chip Package Shielding Layer with Embedded Conductive Connectors
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Solution Overview
Problem
Conventional EMI shielding solutions for small-sized, densely packaged electronic devices operating at high frequencies are costly and lack design flexibility, failing to effectively protect against electromagnetic interference.
Innovation Solution
A chip package design incorporating a substrate, molding compound, and a shielding layer with conductive connectors arranged within the molding compound, where the shielding layer is electrically connected to the substrate through studs or plated via structures, enhancing EMI shielding efficacy while allowing for flexible design adjustments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If conventional metal plates and conductive gaskets are used for EMI shielding, then EMI protection is provided, but manufacturing costs increase
Solution Approach 1:
The patent combines the EMI shielding function with the existing package substrate and molding compound structure. The shielding layer is integrated into the package substrate, and the molding compound encapsulates both the chip and shielding structures, merging multiple functions into a unified structure that reduces manufacturing steps and costs
Solution Approach 2:
The package substrate and molding compound serve dual purposes: structural support and EMI shielding. The conductive connectors embedded in the molding compound automatically provide electrical connection between the shielding layer and ground, eliminating the need for separate grounding operations
2Object-affected harmful factors
If conventional metal plates and conductive gaskets are used for EMI shielding, then EMI protection is provided, but design flexibility is reduced
Solution Approach 1:
The shielding structure is segmented into multiple conductive connectors distributed within the molding compound rather than a single continuous metal plate. This segmentation allows the shielding function to be adapted to different package sizes and chip configurations, providing design flexibility while maintaining EMI protection
Solution Approach 2:
The conductive connectors are strategically positioned at specific locations within the molding compound based on the chip layout and EMI susceptibility. This localized approach allows the shielding design to be optimized for specific application requirements, enhancing adaptability across different device configurations
3Object-affected harmful factors
If shielding layer is electrically connected to substrate through conductive connectors in molding compound, then EMI shielding effectiveness is enhanced, but device complexity increases
Solution Approach 1:
The molding compound serves multiple functions: mechanical encapsulation of the chip, structural support, and as a medium to embed and electrically connect the conductive connectors to the shielding layer. This multi-functionality reduces the need for separate grounding structures, simplifying the overall device architecture despite the enhanced shielding capability
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved EMI shielding effectiveness and design flexibility, reducing manufacturing costs and enhancing the protection of high-frequency devices from electromagnetic interference without requiring additional ground planes.
Implementation Method 1
a shielding layer having a plurality of conductive connectors. The conductive connectors disposed on the substrate are arranged within the molding compound and around the chip. The shielding layer disposed over the molding compound covers the top surface of the molding compound and the shielding layer is electrically connected to the substrate through the conductive connectors
Implementation Method 2
the shielding layer is electrically connected to the substrate through the conductive connectors
Implementation Method 3
a molding compound and a shielding layer having a plurality of conductive connectors. The conductive connectors disposed on the substrate are arranged within the molding compound
Data Source
AI summary
A chip package including a shielding layer having a plurality of conductive connectors for better electromagnetic interferences shielding is provided. The conductive connectors can be flexibly arranged within the molding compound for better shielding performance. The shielding layer having the conductive connectors functions as the EMI shield and the shielding layer is electrically grounded within the package structure.