Metal-Cap Chip Package Shielding for Side EMI Protection
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Solution Overview
Problem
Electronic chips lack comprehensive shielding from electromagnetic radiation, particularly from the side direction, which can affect their performance and reliability.
Innovation Solution
Implementing a metallic sheet at the base of an electronic component and attaching it to a metallic cap on multiple sides to form an enclosure that shields the chip from top, bottom, and side electromagnetic radiation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If comprehensive shielding is implemented with metallic sheet and cap, then shielding effectiveness is improved, but device complexity increases
Solution Approach 1:
The metallic sheet is merged with the package base through fixed connection, and the metallic cap is attached to form an integrated enclosure. This combining of shielding elements with existing package structures reduces overall complexity compared to implementing separate shielding systems for each component
Solution Approach 2:
The metallic sheet serves multiple functions: it provides side shielding from electromagnetic radiation, acts as a structural component of the enclosure, and can be integrated with the package base mounting structure. This multi-functionality reduces the need for additional separate components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively protects the electronic chip from external electromagnetic radiation, enhancing its performance and reliability by providing comprehensive shielding across multiple directions.
Implementation Method 1
a metallic sheet (14) which is fixed to the package base (12). The metallic sheet (14) comprises a first sheet side section (141) on a first side (171) of the enclosure (17) and a central sheet section (145) which underlies the electronic chip (15)
Data Source
AI summary
An electronic component comprising a package base and an at least partly metallic cap which is attached to the package base to form an enclosure. A metallic sheet is fixed to the package base. The metallic sheet comprises a sheet side section and the cap comprises a cap side section. The sheet side section is in contact with the cap side section so that they together form a side-shield on the side of the enclosure.