Chip Package SIW Waveguide Interface for Low-Loss RF Transmission
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-frequency signal transmission in high-frequency applications, such as microwave frequency bands, experiences significant insertion loss due to the use of high-performance materials in printed circuit boards (PCBs), leading to increased costs and reduced system efficiency.
Innovation Solution
A chip package design incorporating a substrate integrated waveguide (SIW) that eliminates the need for high-performance materials in PCBs by directly coupling high-frequency signals from a chip to a metallic waveguide through a SIW, utilizing a chip-to-SIW transition and a SIW-to-waveguide transition with a waveguide aperture and electrical interfaces for efficient signal propagation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If high-performance microwave materials are used in PCB to reduce insertion loss, then signal transmission quality is improved, but system cost increases substantially
Solution Approach 1:
The patent extracts the high-performance microwave materials from the PCB and replaces them with standard PCB materials combined with a substrate integrated waveguide (SIW). The SIW structure, formed by metal plates and vias on a standard PCB substrate, carries the high-frequency signal instead of requiring expensive specialized materials throughout the entire PCB, thus reducing cost while maintaining signal quality.
Solution Approach 2:
The substrate integrated waveguide (SIW) acts as an intermediary structure that enables high-frequency signal transmission without requiring the entire PCB to be made of high-performance materials. The SIW provides a low-loss transmission path through its specialized geometry (metal plates with via holes) while the rest of the PCB can use standard, lower-cost materials.
2Ease of manufacture
If standard PCB materials are used instead of high-performance microwave materials, then system cost is reduced, but insertion loss increases
Solution Approach 1:
The patent replaces the traditional PCB transmission line mechanism with a substrate integrated waveguide (SIW) structure. The SIW uses a different physical mechanism for signal transmission - utilizing waveguide modes between metal plates with via holes - which provides lower insertion loss characteristics compared to standard PCB traces, even when using standard PCB materials.
Solution Approach 2:
The patent changes the transmission mechanism parameters by introducing the SIW structure with specific geometric parameters (plate spacing, via hole dimensions and spacing). These parameter changes enable the structure to support waveguide modes that have lower attenuation characteristics, reducing insertion loss despite using standard PCB materials.
3Ease of manufacture
If a substrate integrated waveguide is implemented to reduce material costs, then system cost is reduced, but device complexity increases
Solution Approach 1:
The patent merges the waveguide structure with the PCB substrate to create a substrate integrated waveguide (SIW). Instead of being separate components, the waveguide walls (metal plates and vias) are integrated directly into the PCB layers, combining the functions of the PCB and waveguide into a single hybrid structure. This integration reduces the number of discrete components and assembly steps.
Solution Approach 2:
The substrate integrated waveguide (SIW) structure serves multiple functions: it provides the waveguide transmission path for low-loss signal propagation, provides grounding references through the via holes, and integrates with the standard PCB fabrication process. This multi-functionality reduces the need for additional separate components and structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces insertion losses and system costs by eliminating the need for high-performance materials in PCBs while maintaining efficient high-frequency signal transmission, thereby enhancing overall system performance and reducing production tolerances.
Implementation Method 1
a substrate integrated waveguide (SIW) for carrying the signal through the chip package
Implementation Method 2
a chip-to-SIW transition structure configured to couple the signal into the SIW from the chip
Implementation Method 3
a SIW-to-waveguide transition structure configured to couple the signal out of the SIW
Data Source
AI summary
A chip package includes a chip configured to generate and/or receive a signal; a laminate substrate including a substrate integrated waveguide (SIW) for carrying the signal, the substrate integrated waveguide including a chip-to-SIW transition structure configured to couple the signal between the SIW and the chip and a SIW-to-waveguide transition structure configured to couple the signal out of the SIW or into the SIW, wherein the SIW-to-waveguide transition structure includes a waveguide aperture; and a plurality of electrical interfaces arranged about a periphery of the waveguide aperture, the plurality of electrical interfaces configured to receive the signal from the SIW-to-waveguide transition structure and output the signal from the chip package or to couple the signal to the SIW-to-waveguide transition structure and into the chip package.