Chip Package With Thin Film Solenoid Coil For Current Detection
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Solution Overview
Problem
Current current detection devices in magnetic field detection types face limitations in enhancing detection sensitivity, as increasing the number of coil turns increases resistance and heat loss, making it challenging to efficiently detect currents while minimizing losses.
Innovation Solution
A chip package design featuring a solenoid coil wound around four outer surfaces of a chip housing with a magnetic field sensor, where the coil has no through holes, reducing resistance and heat loss, and allowing for higher detection sensitivity by using a thin film coil with a large number of turns, and optionally filling the chip housing with soft magnetic powder to enhance magnetic field strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the number of turns of the coil is increased to enhance detection sensitivity, then detection sensitivity is improved, but resistance and heat loss increase
Solution Approach 1:
The patent replaces the conventional wire-wound coil structure with a thin film coil structure formed by depositing conductive material layers. This substitution allows for a large number of turns to be packed into a compact area without proportionally increasing resistance, as the thin film geometry reduces resistive losses while maintaining the magnetic field generation capability needed for high detection sensitivity
Solution Approach 2:
The patent transitions from a three-dimensional wire-wound coil to a two-dimensional thin film coil pattern deposited on a substrate. This dimensional change enables a significantly larger number of turns to be arranged in planar space, increasing the magnetic field strength and detection sensitivity without the resistance penalties associated with adding more wire turns in traditional configurations
2Measurement precision
If a multi-layered printed wiring board structure is used to manufacture the solenoid coil, then a large number of turns can be achieved, but the coil has through holes which increase resistance
Solution Approach 1:
The patent extracts and eliminates the through holes from the coil structure by forming the thin film coil pattern entirely within the planar layers of the substrate. This removal of through holes eliminates the discontinuities and additional contact resistances they introduce, resulting in a more reliable low-resistance path for current flow while still achieving the required number of turns for high detection sensitivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design achieves high detection sensitivity and reduced heat loss, enabling efficient current detection with minimal power consumption, and allows for miniaturization and easy mounting on printed wiring boards, while maintaining high performance and reliability.
Implementation Method 1
when a current to be detected flows through a coil, a magnetic field is generated in the coil. The current detection device detects the current by detecting the magnetic field by a magnetic field sensor
Implementation Method 2
optionally filling the chip housing with soft magnetic powder to enhance magnetic field strength
Data Source
AI summary
A chip package according to one embodiment includes a magnetic field sensor and a chip housing. The chip housing is a rectangular parallelepiped body. A solenoid coil is wound around four outer surfaces of the chip housing. The magnetic field sensor is disposed in the chip package. A plurality of first electrode pads connected to the solenoid coil and a plurality of second electrode pads connected to the magnetic field sensor are disposed on one mounting surface.