Chip Package Structure With Sputtered Stainless Steel Carrier
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Solution Overview
Problem
Conventional chip package manufacturing processes face challenges such as increased costs due to reduced circuit board size, difficulty in handling heavy stainless steel carriers, and inadequate electromagnetic interference shielding, which affects the performance of high-frequency devices.
Innovation Solution
A chip package structure and manufacturing method utilizing a carrier board with a stainless steel layer sputtered on a substrate, allowing for separation without cutting, reducing manufacturing costs, and using the metal layer as a shielding layer for improved electromagnetic interference protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If a stainless steel board is used as the carrier base, then stability and reusability are improved, but weight increases making handling difficult
Solution Approach 1:
The stainless steel board is segmented into a thin-film layer sputtered on the carrier board substrate. This reduces the weight of the stainless steel component from a thick solid board to a thin coating, while maintaining the stability and non-cutting separation benefits of the stainless steel material.
Solution Approach 2:
The patent applies a thin-film stainless steel layer on the carrier board, replacing the conventional thick stainless steel board. This thin-film approach maintains the functional benefits (stability, EMI shielding, separation capability) while significantly reducing weight and improving handling characteristics.
2Duration of action of stationary object
If a stainless steel board is used as the carrier base, then reusability is improved, but sharp edges and corners cause damage to manufacturing equipment
Solution Approach 1:
The stainless steel is segmented into a thin-film coating rather than a thick solid board. This eliminates the sharp edges and corners inherent in thick stainless steel boards, removing the hazard to equipment while preserving the reusability and stability benefits.
Solution Approach 2:
The thin-film stainless steel layer eliminates the geometric sharpness problems of thick stainless steel boards. The thin film conforms to the carrier board substrate and lacks the protruding edges and corners that cause equipment damage, while maintaining functional reusability.
3Object-affected harmful factors
If a metal coating is applied to the molding compound by electroplating or sputtering, then electromagnetic interference shielding performance is improved, but package thickness increases and process costs increase
Solution Approach 1:
The EMI shielding function is merged with the carrier board structure itself. The stainless steel thin-film layer on the carrier board serves dual purposes: as a structural carrier component and as the EMI shielding layer, eliminating the need for separate shielding coatings on the molding compound.
Solution Approach 2:
The EMI shielding layer is prepared in advance as part of the carrier board structure before chip mounting and packaging. The stainless steel thin-film is deposited on the carrier board during carrier board manufacturing, providing pre-established EMI shielding without requiring post-packaging processing.
4Object-affected harmful factors
If a metal coating is applied to the molding compound by electroplating or sputtering, then electromagnetic interference shielding performance is improved, but manufacturing process costs increase
Solution Approach 1:
The EMI shielding function is merged into the carrier board manufacturing process. The stainless steel thin-film deposition is performed during carrier board fabrication, combining two functions (carrier structure and EMI shielding) into a single integrated component, thereby reducing total manufacturing cost.
Solution Approach 2:
The EMI shielding layer is prepared in advance during carrier board manufacturing rather than as a separate post-packaging process. This preliminary preparation integrates the shielding function into the existing carrier board production flow, avoiding additional process steps and reducing overall manufacturing cost.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables safer, cost-effective manufacturing with better heat dissipation and anti-electromagnetic interference performance, reducing package thickness and manufacturing costs compared to conventional methods.
Implementation Method 1
a stainless steel layer sputtered on the substrate
Data Source
AI summary
A manufacturing method a chip package structure. The carrier board includes a substrate and a stainless steel layer sputtered on the substrate. The substrate has multiple first cavities and at least one second cavity. The stainless steel layer conformally covers the first cavities and the second cavity to define multiple third cavities and at least one fourth cavity. Conductive blocks fill the third cavities. At least one metal layer covers the stainless steel layer, the conductive blocks, and the fourth cavity to define at least one fifth cavity. At least one chip is disposed inside the fifth cavity. At least one circuit structure layer is formed on the carrier board. A patterned circuit layer of the circuit structure layer is electrically connected with multiple electrodes of the chip. The carrier board and the circuit structure layer are separated to expose the conductive blocks and the metal layer.