3D Chip Package Stacking for Density and Reliability
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Solution Overview
Problem
The semiconductor industry faces challenges in forming reliable semiconductor devices at increasingly smaller sizes due to the complexity and difficulty of fabrication processes as feature sizes decrease, affecting production efficiency and costs.
Innovation Solution
A chip package structure is designed with a substrate, chip package, conductive bumps, solder caps, and conductive via structures that electrically connect the chip package to the substrate, enhancing device density and routability by using redistribution structures and insulating layers to maintain or increase conductive paths, thereby improving performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If feature sizes continue to decrease to increase functional density, then production efficiency and costs are improved, but fabrication process complexity and difficulty increase
Solution Approach 1:
The patent transitions from planar 2D chip layouts to three-dimensional vertical stacking architecture, where multiple chip layers are stacked and interconnected through through-silicon vias (TSVs). This dimensional change allows continued scaling of functional density without proportionally increasing fabrication complexity, as the vertical integration approach consolidates interconnection paths and enables standardized stacking processes.
Solution Approach 2:
The patent implements nested interconnection structures where conductive via structures are formed within chip layers, and additional conductive bumps are stacked vertically between layers. This nesting approach allows multiple functional layers to be integrated within a compact vertical footprint, maintaining high functional density while using systematic, repeatable fabrication steps for each layer.
2Quantity of substance
If feature sizes continue to decrease, then functional density increases, but reliability of semiconductor devices decreases
Solution Approach 1:
The patent changes the interconnection architecture from lateral planar routes to vertical three-dimensional paths using TSVs and stacked conductive bumps. This parameter change in interconnection geometry reduces the total interconnection length and number of via transitions, thereby improving signal integrity and device reliability while maintaining high functional density through vertical stacking.
Solution Approach 2:
The patent incorporates multiple insulating layers between conductive via structures and stacked conductive bumps to provide electrical isolation and mechanical stress relief. These insulating layers act as cushioning elements that prevent defect propagation and enhance the reliability of the three-dimensional stacked structure before failures can occur.
3Quantity of substance
If redistribution structures and insulating layers are used to maintain conductive paths, then device density and routability increase, but structural complexity increases
Solution Approach 1:
The patent segments the chip interconnection system into discrete modular layers, each with its own conductive via structures, insulating layers, and stacked conductive bumps. This segmentation allows each layer to be fabricated and tested independently, then stacked together to form the complete three-dimensional structure, thereby managing structural complexity through modularity while achieving high device density.
Data Source
AI summary
A chip package structure is provided. The chip package structure includes a substrate. The chip package structure includes a chip package stacked over the substrate. The chip package structure includes first conductive bumps arranged between and in direct contact with the chip package and the substrate providing a clearance. The chip package structure includes a chip structure having a first face and an opposing second face arranged in the clearance between the chip package and the substrate and adjacent to the first conductive bumps. The chip structure contains at least one chip. The chip package structure includes a solder cap connecting the first face of the chip structure and the chip package. The chip package structure includes a second conductive bump connecting the second face of the chip structure and the substrate.