Chip Package Pad Structure for Bonding Stress Relief
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Solution Overview
Problem
The bonding process between semiconductor packages and substrates often results in reduced yield due to bonding stress, which can damage insulating layers and conductive via structures.
Innovation Solution
A chip package structure is formed with a conductive pad that has a first portion passing through both the barrier layer and the insulating layer to connect with a conductive via structure, and a second portion passing through the insulating layer, allowing the bonding stress to be directly conducted to the barrier layer and substrate, thereby protecting the insulating layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the bonding process is performed between package and substrate, then the packages are connected and formed into functional assemblies, but bonding stress damages the insulating layer and conductive via structures, reducing yield
Solution Approach 1:
The conductive pad serves as an intermediary element between the conductive bump and the conductive via structure. It provides a dedicated stress transmission path through its first portion that directly connects to the conductive via structure, while its second portion interfaces with the conductive bump. This intermediary structure protects the insulating layer by channeling bonding stress away from it and into the conductive pad's first portion, thereby resolving the contradiction between achieving reliable bonding connections and preventing stress-induced damage to underlying structures.
Solution Approach 2:
The conductive pad is segmented into two distinct portions: a first portion that passes through the insulating layer to connect with the conductive via structure, and a second portion that interfaces with the conductive bump. This segmentation allows each portion to fulfill its specific function - the first portion handles stress transmission and structural support, while the second portion provides the bonding interface. The segmentation resolves the technical contradiction by separating the stress transmission function from the bonding function, protecting the insulating layer while ensuring reliable connections.
2Stability of the object's composition
If the insulating layer is present to provide electrical isolation, then electrical insulation is achieved, but bonding stress concentrates on the insulating layer causing damage and reducing manufacturing yield
Solution Approach 1:
The conductive pad's first portion acts as an intermediary that provides an alternative stress transmission path. Instead of bonding stress concentrating on the insulating layer, the stress is transmitted through the conductive pad's first portion directly to the conductive via structure. The insulating layer maintains its electrical isolation function while being relieved of mechanical stress concentration, thereby resolving the contradiction between maintaining electrical insulation stability and achieving high bonding manufacturing yield.
3Reliability
If the conductive pad connects directly to the conductive via structure through the insulating layer, then electrical connection is established, but bonding stress may damage the insulating layer at the connection point
Solution Approach 1:
The conductive pad is divided into two portions with distinct functions. The first portion penetrates the insulating layer to establish electrical connection with the conductive via structure, ensuring electrical connection integrity. The second portion provides the bonding interface for the conductive bump. This segmentation allows the first portion to handle the electrical connection function while the overall conductive pad structure manages bonding stress, preventing stress concentration at the insulating layer connection point and resolving the contradiction between electrical connection reliability and insulating layer strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the yield of the bonding process by preventing damage to the insulating layer from bonding stress and ensuring the integrity of the conductive via structures.
Implementation Method 1
allowing the bonding stress to be directly conducted to the barrier layer and substrate
Data Source
AI summary
A chip package structure is provided. The chip package structure includes a first substrate. The chip package structure includes a conductive via structure passing through the first substrate. The chip package structure includes a barrier layer over a surface of the first substrate. The chip package structure includes an insulating layer over the barrier layer. The chip package structure includes a conductive pad over the insulating layer. The conductive pad has a first portion passing through the insulating layer and the barrier layer and connected to the conductive via structure. The chip package structure includes a conductive bump over the conductive pad. The chip package structure includes a second substrate. The chip package structure includes an underfill layer between the first substrate and the second substrate.