Chip Package With Substrate Recess For Vertical Device Integration
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Solution Overview
Problem
The existing chip packaging process limits the miniaturization of electronic products due to the size constraints of chip modules, necessitating a novel approach to integrate electronic devices within the chip package without increasing its size.
Innovation Solution
A chip package design featuring a substrate with a recess and a redistribution layer that allows for the vertical integration of electronic devices, enabling the embedding of multiple devices within the substrate without expanding the package dimensions, and a method for forming this package involving etching processes to create the necessary structural elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If electronic devices are disposed on a circuit board to form chip modules, then electrical connection paths are provided, but the size of the chip modules is limited and difficult to reduce further
Solution Approach 1:
The patent transitions from planar arrangement of electronic devices on a circuit board to three-dimensional vertical stacking within the substrate. Multiple electronic devices are disposed at different depths within the substrate, with redistribution layers extending vertically to provide electrical connections between stacked devices, thereby reducing the chip module size while maintaining functionality.
Solution Approach 2:
The patent embeds multiple electronic devices within the substrate in a nested configuration, where devices are positioned at different vertical levels and interconnected through redistribution layers that extend into recesses. This nested arrangement allows multiple functional elements to coexist within a compact volume, eliminating the need for separate chip modules on a circuit board.
2Volume of moving object
If multiple electronic devices are integrated within the substrate vertically, then the overall size is reduced, but the manufacturing process becomes more complex
Solution Approach 1:
The substrate is divided into multiple functional regions with recesses formed at specific locations to accommodate different electronic devices. Each recess and redistribution layer is segmented to serve specific devices, allowing for modular integration that simplifies the overall manufacturing process while achieving compact three-dimensional packaging.
3Adaptability or versatility
If the recess extends deeply into the substrate to vertically overlap the sensing region, then device integration is enabled, but manufacturing precision requirements increase
Solution Approach 1:
The recesses are formed in the substrate before the electronic devices are disposed within them. This preliminary formation of recesses with precise dimensions and positions allows subsequent device placement and redistribution layer formation to proceed with standard precision requirements, rather than requiring ultra-precise alignment during device assembly.
Data Source
AI summary
A chip package including a substrate is provided. The substrate has a first surface and a second surface opposite thereto. The substrate includes a sensing or device region which is adjacent to the first surface. A recess is in the substrate. The recess extends from the second surface towards the first surface, and vertically overlaps the sensing or device region. A redistribution layer is electrically connected to the sensing or device region, and extends from the second surface into the recess. A method of forming the chip package is also provided.