Chip Package Support Structure for Even Pressure Deformation

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Solution Overview

Problem

Existing substrate designs for mobile products face challenges in balancing electrical signal connection performance with mechanical strength and toughness, particularly in distributing external pressure to prevent locally large deformations that can damage stacked chips.

Innovation Solution

A package structure is designed with a substrate, a stack structure of chips, and a molding layer, where a support structure penetrates through the molding layer and is positioned around the periphery of the stack structure, having a height greater than the stack structure, to decentralize external pressure and facilitate even deformation, thereby enhancing mechanical strength and reducing damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the substrate design focuses on electrical signal connection performance, then electrical performance is improved, but mechanical strength and toughness deteriorate

Engineering Contradiction:

Improveelectrical signal connection performanceVSAvoidmechanical strength and toughness

Core Design Contradiction:

ReliabilityVSStrength

Solution Approach 1:

The package structure is segmented into distinct functional components: the substrate for electrical connections, the molding layer for encapsulation, and the support structure for mechanical strength. This segmentation allows each component to be optimized for its specific function without compromising the others.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The support structure acts as an intermediary element between the substrate and the external environment. It mediates the mechanical stresses by distributing external pressure before it reaches the substrate and chip stack, thereby protecting the electrically critical components while maintaining overall structural integrity.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Stability of the object's composition

If external pressure is applied to the package, then the package deforms, but local large deformations occur that can damage stacked chips

Engineering Contradiction:

Improvepackage deformation behaviorVSAvoidlocal large deformations damaging chips

Core Design Contradiction:

Stability of the object's compositionVSObject-affected harmful factors

Solution Approach 1:

The support structure is strategically positioned around the periphery of the stack structure, providing localized reinforcement where mechanical stresses are most concentrated. This local quality enhancement allows the package to deform evenly under external pressure without creating stress concentration points that could damage the chips.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The support structure serves as a pre-positioned cushioning element that absorbs and distributes external pressure before it can transmit harmful localized stresses to the chip stack. By being in place beforehand, it prevents the formation of local large deformations that would otherwise damage the stacked chips.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

3Strength

If the support structure penetrates through the molding layer and is positioned around the periphery of the stack structure with height greater than the stack structure, then mechanical strength is enhanced and pressure is decentralized, but device complexity increases

Engineering Contradiction:

Improvemechanical strengthVSAvoidpackage structure complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The support structure performs multiple functions simultaneously: it provides mechanical strength, decentralizes external pressure, protects the chip stack from damage, and maintains package integrity. This multi-functionality justifies the additional structural element by delivering multiple benefits from a single component.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The support structure extends in the vertical dimension by penetrating through the molding layer and having height greater than the stack structure. This dimensional extension allows it to effectively intercept and distribute vertical external pressures, providing mechanical protection that would be difficult to achieve with planar structures alone.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS20240379473A1Package structure and fabrication method thereof, memory system and electronic apparatus

Publication Date: 2024.11.14 YANGTZE MEMORY TECH CO LTD

AI summary

Examples of the present disclosure disclose a package structure and a fabrication method thereof, a memory system and an electronic apparatus. The package structure includes: a substrate; a first stack structure located on the substrate and including: at least one first chip; a molding layer located on the substrate and encapsulating the first stack structure; and first support structure penetrating the molding layer and located on the periphery of the first stack structure. The first support structure has a height greater than that of the first stack structure.