Chip Package Array Supporting Structure Warping Prevention

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Solution Overview

Problem

The semiconductor industry faces challenges in increasing the structural strength and reducing production costs of chip packages, particularly during the packaging process, where warping occurs and yield is affected.

Innovation Solution

A chip package structure is designed with a supporting structure having openings, where the chip is placed within these openings and encapsulated material is filled between the chip and the supporting structure, enhancing structural strength and reducing production costs by alleviating warping and improving yield.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If a supporting structure is added to each chip package, then structural strength is improved, but device complexity increases

Engineering Contradiction:

Improvestructural strengthVSAvoidstructure complexity

Core Design Contradiction:

StrengthVSDevice complexity

Solution Approach 1:

The supporting structure is divided into multiple separate supporting pieces, each positioned at different locations within the encapsulated material. This segmentation provides distributed structural support to prevent warping while maintaining manufacturing simplicity, as each supporting piece can be independently positioned and removed without complicating the overall process

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The supporting structure uses a porous or open-framework design where multiple supporting pieces are arranged with spaces between them. This allows the encapsulated material to be easily filled while providing sufficient structural support. The porous arrangement reduces material usage and simplifies the filling process compared to a solid continuous support structure

Inventive Principle:

Principle #31Porous materials

2Reliability

If supporting structure is used to prevent warping, then manufacturing yield is improved, but production cost increases

Engineering Contradiction:

Improvemanufacturing yieldVSAvoidproduction cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The supporting pieces are positioned in advance within the mold cavity before the encapsulated material is injected. This preliminary placement ensures proper support structure formation without requiring complex post-processing or additional manufacturing steps, thereby maintaining cost-effectiveness while preventing warping during the packaging process

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The supporting pieces are designed as temporary, disposable structures that are removed after serving their purpose of preventing warping during encapsulation. These simple, inexpensive supporting elements (such as porous ceramic or plastic pieces) are discarded after use, avoiding the need for expensive permanent support structures or complex removal mechanisms

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

Data Source

PatentUS11227848B2Chip package array, and chip package

Publication Date: 2022.01.18 VIA ALLIANCE SEMICON CO LTD

AI summary

A chip package array including a plurality of chip packages is provided. The chip packages are suitable for array arrangement to form the chip package array. Each of the chip packages includes a redistribution structure, a supporting structure, a chip, and an encapsulated material. The supporting structure is disposed on the redistribution structure and has an opening. The chip is disposed on the redistribution structure and located in the opening. The encapsulated material is located between the opening and the chip, wherein the encapsulated material is filled between the opening and the chip, and the chip and the supporting structure are respectively connected to the redistribution structure.