Method and testing system for testing semiconductor chip packages
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Solution Overview
Problem
Current methods for testing semiconductor chip packages face inefficiencies due to separate mechanical and electrical testing, leading to inconsistent results, long testing cycles, high costs, and underestimation of packaging strain, particularly in high-density die integration.
Innovation Solution
A system and method for simultaneous mechanical and electrical testing of semiconductor chip packages, utilizing a mechanical testing sub-system, electrical testing sub-system, and a controller to coordinate and transition between testing stages based on preset trigger conditions, ensuring comprehensive evaluation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If separate mechanical and electrical testing is performed on semiconductor chip packages, then testing can be conducted using conventional methods, but testing efficiency is low and testing cycles are long
Solution Approach 1:
The patent combines separate mechanical testing and electrical testing systems into an integrated testing platform. The mechanical testing subsystem and electrical testing subsystem are merged to operate simultaneously on the same semiconductor chip package, eliminating the need for sequential testing and significantly improving testing efficiency while reducing total testing time.
Solution Approach 2:
The integrated testing system enables continuous simultaneous operation of mechanical and electrical testing throughout the evaluation process. Both testing modes run in parallel without interruption or idle time between tests, maximizing the utilization of testing resources and minimizing the overall testing cycle.
2Ease of manufacture
If separate mechanical and electrical testing is performed, then conventional testing procedures can be followed, but testing costs are high
Solution Approach 1:
By merging mechanical and electrical testing into a single integrated system, the patent eliminates duplicate testing equipment and operational procedures. This consolidation reduces overall testing costs while maintaining the simplicity of conventional testing procedures through automated coordination of both test types.
Solution Approach 2:
The integrated testing system provides multi-functionality by performing both mechanical and electrical testing capabilities within a single platform. This universal system can handle multiple testing requirements simultaneously, improving cost efficiency by eliminating the need for separate dedicated testing equipment for each test type.
3Reliability
If separate mechanical and electrical testing is conducted, then individual test results can be obtained, but comprehensive evaluation of packaging performance is insufficient
Solution Approach 1:
The patent merges mechanical and electrical testing into an integrated system that provides comprehensive evaluation of semiconductor chip package performance. By combining both test types in a coordinated manner, the system achieves accurate and reliable assessment of packaging performance that neither separate testing could provide alone.
Solution Approach 2:
The integrated testing system incorporates feedback mechanisms that allow real-time monitoring and coordination between mechanical and electrical test results. This feedback enables comprehensive evaluation by correlating mechanical deformation data with electrical performance data, providing a complete picture of packaging performance under various conditions.
4Quantity of substance
If conventional separate testing methods are used, then existing testing equipment can be utilized, but the number of test samples required is large
Solution Approach 1:
The integrated testing system enables continuous simultaneous mechanical and electrical testing on the same sample, maximizing the information obtained from each test subject. This continuous parallel operation reduces the number of samples needed while maintaining statistical validity, and simultaneously shortens the overall testing cycle by eliminating sequential testing delays.
Data Source
AI summary
A method and a testing system for testing a semiconductor chip package are provided. The method includes fixing, by a mechanical testing sub-system of the testing system, the semiconductor chip package within the mechanical testing sub-system, such that the semiconductor chip package is aligned with pressure components of the mechanical testing sub-system and is electrically connected to an electrical testing sub-system of the testing system; simultaneously performing, by the mechanical testing sub-system and the electrical testing sub-system, a first stage of a mechanical testing and an electrical testing on the semiconductor chip package; and in response to determining, by a controller of the testing system, that a preset trigger condition of the mechanical testing or the electrical testing is reached, controlling the mechanical testing sub-system to switch the first stage of the mechanical testing to a second stage of the mechanical testing.