Chip Package Thermal Conductor for Heat Dissipation and Warpage Control
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Solution Overview
Problem
New packaging technologies for semiconductor dies face manufacturing challenges, particularly in achieving high density and functionality while ensuring effective heat dissipation and protection from environmental contaminants.
Innovation Solution
A package structure is formed with a substrate carrying dies or packages, incorporating a protective element that also functions as a warpage-control and heat dissipation element, using a thermal conductive material like diamond or graphene with high thermal conductivity, and a bonding structure for electrical connections, ensuring planarized surfaces for reliable bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If new packaging technologies are used to improve density and functionality, then functional density increases, but manufacturing challenges arise
Solution Approach 1:
The package structure is divided into multiple functional layers including substrate, protective element, bonding structure, and planarized structure. This segmentation allows each layer to be optimized independently for its specific function while simplifying the overall manufacturing process by enabling modular assembly and testing at intermediate stages.
Solution Approach 2:
The protective element serves multiple functions simultaneously: it protects semiconductor devices from environmental contaminants, controls warpage during manufacturing, and dissipates heat. This multi-functionality reduces the need for separate components, thereby simplifying the manufacturing process while maintaining high functional density.
2Reliability
If protective elements are added to protect from environmental contaminants, then protection is improved, but device complexity increases
Solution Approach 1:
The protective element is designed to perform multiple functions including environmental protection, warpage control, and heat dissipation. By consolidating these functions into a single component rather than using separate elements for each function, the overall device complexity is reduced while maintaining comprehensive protection.
Solution Approach 2:
The protective element is merged with the bonding structure and integrated into the substrate assembly. This merging eliminates the need for separate protective components and simplifies the manufacturing process by reducing the number of assembly steps and components required.
3Temperature
If thermal conductive materials are used to improve heat dissipation, then thermal conductivity increases, but manufacturing complexity increases
Solution Approach 1:
The protective element is designed to serve as both a protective barrier and a thermal conduction path. By incorporating thermal conductive materials into this multi-functional component rather than adding separate heat dissipation components, the manufacturing process is simplified while achieving effective heat management.
Solution Approach 2:
The package structure utilizes composite materials including diamond, graphene, or other high thermal conductivity materials integrated into the protective element and bonding structure. These composite materials provide superior thermal conductivity while maintaining structural integrity and compatibility with existing manufacturing processes.
4Reliability
If planarized surfaces are created for reliable bonding, then bonding reliability improves, but manufacturing steps increase
Solution Approach 1:
The planarized structure is formed as a preliminary step before the final bonding process. By preparing planar surfaces in advance on the substrate and protective element, the subsequent bonding operation can proceed reliably without requiring additional complex alignment or surface preparation steps during assembly.
Solution Approach 2:
The planarization process is merged with the formation of the protective element and bonding structure. By integrating surface planarization into the existing manufacturing flow rather than treating it as a separate post-processing step, the overall number of manufacturing steps is minimized while ensuring bonding reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances heat dissipation and maintains structural integrity, improving the performance and reliability of semiconductor devices by preventing damage during manufacturing processes and ensuring efficient thermal conductivity.
Implementation Method 1
a material layer between the first chip-containing structure and the second chip-containing structure. The material layer has a thermal conductivity greater than 400 W/mK
Data Source
AI summary
A package structure and a formation method are provided. The method includes forming multiple patterned material elements over a carrier substrate, and the patterned material elements are more thermal conductive than copper. The method also includes forming a protective layer laterally surrounding each of the patterned material elements. The method further includes bonding a chip-containing structure to a first patterned material element of the patterned material elements through dielectric-to-dielectric bonding and metal-to-metal bonding.