Chip Package Cover Pressure Structure for Stable Thermal Contact
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Solution Overview
Problem
Conventional chip packaging technologies face a significant reduction in heat dissipation performance due to the formation of gaps between the thermal interface material and the package cover, caused by machining tolerance and degradation of the thermal interface material's elastic force over time.
Innovation Solution
A chip package structure that includes a PCB, a chip, a package cover, a thermal interface material layer, and a heat sink, where a contact plate with an abutting member is used to concentrate pressure on the package cover, ensuring the thermal interface material remains attached and preventing gaps, thereby maintaining effective heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional thermal interface material is used without additional support structures, then the device complexity is reduced, but gaps form between the thermal interface material and package cover over time, reducing heat dissipation performance
Solution Approach 1:
An abutting member is introduced as an intermediary component between the contact plate and the package cover. This abutting member provides continuous elastic support to the thermal interface material, ensuring maintained contact pressure and preventing gap formation. The abutting member acts as a mediator that transfers and distributes the pressing force uniformly, resolving the technical contradiction by adding a targeted support element rather than redesigning the entire package structure.
Solution Approach 2:
The abutting member provides beforehand cushioning by maintaining constant elastic pressure on the thermal interface material before gaps can form. This preventive mechanism compensates for the degradation of elastic force in the thermal interface material over time, ensuring that contact pressure is maintained throughout the product lifecycle. The abutting member anticipates and counteracts the natural relaxation and gap formation that would otherwise occur during long-term operation.
2Ease of manufacture
If the thermal interface material is allowed to degrade naturally over time, then the device simplicity is maintained, but machining tolerance and material degradation cause hole formation, reducing heat transfer efficiency
Solution Approach 1:
The abutting member changes the pressure parameter dynamically by providing continuous elastic support. As the thermal interface material degrades and loses elastic force over time, the abutting member compensates by maintaining constant pressing force through its own elastic properties. This parameter change ensures that the contact pressure between the thermal interface material and package cover remains within the optimal range throughout the product lifecycle, preventing hole formation while maintaining manufacturing simplicity.
3Duration of action of stationary object
If elastic force of thermal interface material degrades over time, then no additional components are needed, but hole formation occurs between thermal interface material and package cover, reducing heat dissipation
Solution Approach 1:
The abutting member performs preliminary action by providing continuous elastic support to the thermal interface material from the beginning of operation. This preliminary support prevents the degradation of contact pressure that would naturally occur as the thermal interface material loses elastic force over time. By establishing this support mechanism in advance, the system maintains thermal contact integrity throughout the extended service life of the thermal interface material, preventing hole formation even as the material ages.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures consistent and efficient heat dissipation for the chip, maintaining performance over long-term operation by ensuring the thermal interface material remains attached to both the chip and the package cover, thus preventing the formation of gaps and enhancing the chip's heat dissipation capabilities.
Implementation Method 1
When the abutting member is an elastic object, regardless of whether the heat sink is a floating heat sink or a fastened heat sink, the abutting member can provide elastic pressing force for the package cover
Implementation Method 2
heat generated by the chip in a package structure needs to be conducted to a heat sink by using a thermal interface material
Data Source
AI summary
A chip package structure is provided and includes a PCB, a chip, a package cover, a thermal interface material layer, and a heat sink. The chip is welded to the PCB. The package cover is disposed on the PCB. The chip is packaged in the package cover. The thermal interface material layer covers the chip, and is attached to an inner top surface of the package cover. The heat sink is disposed on the PCB. An assembly space is formed between the heat sink and the PCB. The heat sink includes a contact plate. A lower end face of the contact plate abuts against an outer top surface of the package cover. A projection of the abutting member in a height direction of the chip package structure covers the chip, and is located in a region enclosed by an edge of the outer top surface of the package cover.