Multi-Chip Package Spacer Recess for Thermal Isolation
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Solution Overview
Problem
In multi-chip semiconductor packages, the heat generated by high-power chips can adversely affect the operation of low-power memory chips, leading to reliability issues due to inadequate thermal management.
Innovation Solution
An electronic package design featuring a spacer with a recess acting as a thermal insulation area between adjacent components, filled with air or an insulating material, which has a thermal conductivity less than the encapsulation layer, effectively preventing heat transfer from high-power to low-power components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If multiple semiconductor chips are bonded onto a package substrate via solder bumps, then the computational performance and signal integrity are improved, but the heat generated by high-power chips adversely affects the operation of memory chips
Solution Approach 1:
The package substrate is segmented into different thermal zones by introducing spacers that create physical separation between high-power and low-power chips. The spacers divide the continuous substrate into isolated thermal regions, preventing heat propagation from high-power chips to memory chips while maintaining electrical connectivity through the substrate's circuitry.
Solution Approach 2:
Thermal spacers are introduced as intermediary elements between high-power and low-power chips. These spacers act as thermal barriers with low thermal conductivity, mediating the thermal interaction between adjacent chips. The spacers are positioned at strategic locations to block heat flow paths while allowing the package to function as an integrated system.
2Productivity
If high-power chips are integrated with memory chips in the same package, then the I/O pins and computational performance are improved, but the operating temperature range of memory chips cannot be strictly controlled
Solution Approach 1:
The package substrate exhibits local quality variations in terms of thermal properties. Different regions of the substrate are designed with different thermal characteristics - areas near high-power chips have thermal barriers (spacers) with low thermal conductivity, while areas near memory chips have higher thermal conductivity to maintain stable operating temperatures. This spatial variation in thermal properties allows simultaneous integration of high-power and low-power chips.
Solution Approach 2:
Thermal spacers serve as intermediary elements that control the thermal environment of memory chips. By positioning these spacers between high-power and low-power chips, the thermal influence from high-power chips is blocked, allowing memory chips to operate within their specified temperature ranges even when high-power chips generate substantial heat.
3Reliability
If spacers are introduced to provide thermal insulation between chips, then the thermal management is improved, but the device complexity increases
Solution Approach 1:
The thermal spacers are implemented as thin film structures deposited on the package substrate. These thin film spacers provide effective thermal insulation while occupying minimal space and adding minimal structural complexity. The thin film nature allows for integration with existing semiconductor manufacturing processes, reducing the overall complexity increase.
Solution Approach 2:
The package substrate is designed as a composite structure combining different materials with complementary properties. The substrate integrates high-power chips, low-power chips, and thermal spacers made of materials with different thermal conductivities. This composite approach allows the package to achieve effective thermal management while maintaining a relatively simple overall structure that can be manufactured using standard multi-chip module techniques.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively insulates high-power components from low-power ones, enhancing the reliability of the package by preventing heat-induced operational issues and improving thermal management.
Implementation Method 1
a recess is formed in the spacer and used as a thermal insulation area, wherein a depth of the recess is greater than a height of the plurality of electronic components
Data Source
AI summary
An electronic package is provided, which includes a plurality of electronic components encapsulated by an encapsulation layer. A spacer is defined in the encapsulation layer and located between at least two adjacent electronic components of the plurality of electronic components, and a recess is formed in the spacer and used as a thermal insulation area. With the design of the thermal insulation area, the plurality of electronic components can be effectively thermally insulated from one another to prevent heat generated by one electronic component of high power from being conducted to another electronic component of low power that would thermally affect the operation of the low-power electronic component. A method for manufacturing the electronic package is also provided.