Miniaturized Chip Package With Through Hole Supporter
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Solution Overview
Problem
Conventional image sensor chip packages are bulky due to the need for sufficient space around the chip for wire bonding tools, making them unsuitable for compact electronic devices.
Innovation Solution
A miniaturized chip package design featuring a supporter with a through hole and top contacts, where the chip is placed within the hole, connected via wires, and secured with a main adhesive, and covered with a transparent plate, reducing the overall package volume and improving sealing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If sufficient space is provided around the chip for wire bonding tools, then wire bonding can be performed, but the package volume becomes larger
Solution Approach 1:
Instead of providing space around the chip for wire bonding tools, the patent inverts the approach by forming the conductor member integrally with the base plate, allowing wire bonding to be performed on the bottom surface of the package where tools can access from underneath, thus eliminating the need for peripheral space
Solution Approach 2:
The patent moves the wire bonding operation from the horizontal plane (peripheral area) to the vertical dimension (bottom surface), enabling wire bonding tools to access the chip connections from below the package rather than from the sides
2Stability of the object's composition
If the chip is secured with adhesive covering pads and wires, then the chip is fixed, but the pads and wires are covered and cannot be accessed
Solution Approach 1:
The patent segments the adhesive application into two distinct zones: a first adhesive applied to the top surface that covers only the chip periphery and excludes the pads and wires, and a second adhesive applied to the bottom surface for additional fixation, thereby maintaining both chip stability and access to electrical components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design minimizes package volume, facilitates easier wire bonding, and enhances the digital camera module's reliability by reducing dust and water vapor ingress, leading to improved image quality and device compactness.
Implementation Method 1
The main adhesive is applied to a gap between the chip and the supporter and fixes the chip to the supporter. The cover plate is adhered to and supported on the main adhesive.
Data Source
AI summary
A digital camera module (100) includes a chip package (110) and a lens module (130), mounted on the chip package, for forming a focused image on the chip package. The chip package includes a supporter (112), a chip (114), a plurality of wires (116), a main adhesive (118), and a cover plate (119). The supporter includes a through hole defined therethrough and has a plurality of top contacts (1130) formed thereon around the through hole. The chip is disposed in the through hole and includes a plurality of pads (1144) arranged thereon. The wires electrically connect the pads to the top contacts. The main adhesive is applied to a gap between the chip and the supporter and fixes the chip to the supporter. The cover plate is adhered and supported on the main adhesive. A method for making the chip package is also provided.